2019
DOI: 10.1021/acsami.8b20581
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Single GaAs Nanowire/Graphene Hybrid Devices Fabricated by a Position-Controlled Microtransfer and an Imprinting Technique for an Embedded Structure

Abstract: We developed a new technique to fabricate single nanowire devices with reliable graphene/nanowire contacts using a position-controlled microtransfer and an embedded nanowire structure in a planar junction configuration. A thorough study of electrical properties and fabrication challenges of single p-GaAs nanowire/graphene devices was carried out in two different device configurations: (1) a graphene bottom-contact device where the nanowire–graphene contact junction is formed by transferring a nanowire on top o… Show more

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Cited by 9 publications
(7 citation statements)
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“…As shown in Figure 6 , the band structures based on Anderson’s rule are used to clarify the physics behind the above-observed I-V characteristics of camphor-based CVD graphene/p-Si Schottky PDs [ 46 , 54 , 55 , 56 , 57 ]. Figure 6 a is the band structure of the camphor-based CVD graphene/p-Si heterostructure at thermal equilibrium under zero bias.…”
Section: Measurement Results and Discussionmentioning
confidence: 99%
“…As shown in Figure 6 , the band structures based on Anderson’s rule are used to clarify the physics behind the above-observed I-V characteristics of camphor-based CVD graphene/p-Si Schottky PDs [ 46 , 54 , 55 , 56 , 57 ]. Figure 6 a is the band structure of the camphor-based CVD graphene/p-Si heterostructure at thermal equilibrium under zero bias.…”
Section: Measurement Results and Discussionmentioning
confidence: 99%
“…Once this two-step cascaded etching profile is made (inspected with scanning electron microscopy after each step), single NWs were embedded in a curable photoresist layer through a resist etch-back method. This structure helps to form better electrical contacts in the planar single-NW configuration . Three different metal electrodes were then deposited successively to form separate electrical contacts to the outermost radial n ++ -GaAs cap, i-GaAs shell, and inner p-GaAs core separately at the top, middle, and bottom parts of the NW, respectively.…”
Section: Methodsmentioning
confidence: 99%
“…This structure helps to form better electrical contacts in the planar single-NW configuration. 39 Three different metal electrodes were then deposited successively to form separate electrical contacts to the outermost radial n ++ -GaAs cap, i-GaAs shell, and inner p-GaAs core separately at the top, middle, and bottom parts of the NW, respectively. In this process, Pd (20 nm)/Ge (40 nm)/Au (250 nm), Ti (10 nm)/Au (250 nm), and Pt (5 nm)/Ti (10 nm)/Pt (10 nm)/Au (200 nm) metal electrodes were deposited to form ohmic electrical contacts to the n ++ -GaAs cap, i-GaAs shell, and p-GaAs NW core separately.…”
Section: Nanoprobing To Singlementioning
confidence: 99%
“…After a successful etching of the shell, single NWs were partially embedded in a curable photoresist layer by employing a resist etch-back method using O 2 -plasma ashing . A planar embedded configuration of single NWs has recently been reported as a superior structure compared to a conventional nonembedded structure when an ohmic contact between a NW and its contact electrode is desired . Metal contact electrodes were fabricated to the shell-etched p- and n-parts of the NW by using two successive EBL and lift-off processes, where Pt (5 nm)/Ti (10 nm)/Pt (10 nm)/Au (150 nm) and Pd (20 nm)/Ge (40 nm)/Au (150 nm) metal stacks were deposited on the p- and n-sides of the NW, respectively. , All metal contacts were annealed at 280 °C for 30 s to form ohmic contacts between the NW and the metal electrodes. , …”
Section: Methodsmentioning
confidence: 99%