2009
DOI: 10.1016/j.tsf.2009.05.025
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Single layer and multilayered films of plasma polymers analyzed by nanoindentation and spectroscopic ellipsometry

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Cited by 13 publications
(10 citation statements)
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“…The thickness of the buffer layer was 1 064 nm and the overlayer was 7 nm. A correlation between the refractive index n and mechanical properties ( E , H ) was shown in our previous study,22 and the refractive index together with the mechanical properties increased with enhanced power. All the parameters ( n , E , H ) correspond to the crosslinking of plasma polymer which is influenced by RF power.…”
Section: Resultssupporting
confidence: 63%
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“…The thickness of the buffer layer was 1 064 nm and the overlayer was 7 nm. A correlation between the refractive index n and mechanical properties ( E , H ) was shown in our previous study,22 and the refractive index together with the mechanical properties increased with enhanced power. All the parameters ( n , E , H ) correspond to the crosslinking of plasma polymer which is influenced by RF power.…”
Section: Resultssupporting
confidence: 63%
“…The overlayer was modeled as the effective medium26 with a fixed ratio (50%) of the film material and air. Any interlayer between the a‐SiC:H layer and the substrate can be disregarded following previous research 22. Ellipsometric data obtained for O 2 ‐plasma‐pretreated silicon wafers enabled us to evaluate the thickness of the silicon dioxide layer at the surface of the wafer; the value was 4.1 nm.…”
Section: Resultsmentioning
confidence: 99%
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“…Layer B was the first layer deposited on the buffer layer; layer A was the last layer, at the surface of multilayer film. Ten layers of the a‐SiC:H multilayer film were sectioned from the film surface at a shallow angle of 4° using a Leica EM UC6 Ultramicrotome (Leica Microsystems) . A 1 µm‐thick buffer layer was used to prevent damage to the diamond knife from contact with the silicon wafer.…”
Section: Mechanical Properties Of Plasma Polymer Filmsmentioning
confidence: 99%