Singular stress amplification between two holes in tension

Wu, Linping; Markenscoff, Xanthippi

doi:10.1007/bf00042474

Cited by 13 publications

(11 citation statements)

References 19 publications

(13 reference statements)

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“…It should be recalled in this context that the stress magnification in a thin ligament between two holes in a stretched infinite medium is only of the order (R/δ) 1/2 , which was obtained in [22] by using an asymptotic analysis of the two-dimensional elasticity solution.…”

Section: Strip Weakened By Two Large Holes Under Tensionmentioning

confidence: 98%

Stress Magnification due to Stretching and Bending of Thin Ligaments between Voids

Lubarda

Markenscoff

2006

Arch Appl Mech

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Stress magnification in thin ligaments between small and large cylindrical voids is obtained by matching the inner field approximation by beam theory to the outer rigid-body field in the bulk of the material. A void between two larger voids is modeled as a large hole within a strip of straight edges (boundaries of the holes with infinite radii of curvature). Both stretching and bending types of loading are applied to the strip. Comparison of different orders of stress magnification for different geometries and loading conditions is made. It is shown that the order of stress magnification in thin ligaments is (R/δ) n , where n = 1/2 in the ligament between one small and one large void, n = 1 in the ligament between one small void and two large voids, or between two small and two large voids, and n = 2 in the ligament between a large void and a small void coalescing with another large void. The relevance of these results for the study of material failure by void growth and coalescence is discussed.

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Section: Strip Weakened By Two Large Holes Under Tensionmentioning

confidence: 98%

Stress Magnification due to Stretching and Bending of Thin Ligaments between Voids

Lubarda

Markenscoff

2006

Arch Appl Mech

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“…Their results underestimated the SCF compared to the works by Ling, Haddon and Ishida [3], [4]. The stress amplification between two holes under tension was modelled by Wu and Markenskoff [5]. The amplification between the holes was expressed in terms of the holes' edge to edge distance.…”

Section: Introductionmentioning

confidence: 96%

A Stress concentration factor for interacting surface notch and subsurface hole

Gebrehiwot

Remes

Karttunen

2018

RakMek

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We propose a conservative method for the calculation of the maximum stress concentration factor (SCF) for an interacting notch-hole pair and for a double semi-circular notch (i.e., a notch that has an additional small semi-circular notch ahead of its tip). The method is based on a linearly elastic Airy stress function solution for a circular hole. The notch-hole and double notch configurations are aligned vertically with respect to uniform uniaxial (horizontal) stress. This means, a uniform horizontal tension is applied to a notch-hole pair that lie on a vertical axis. For the notch-hole pair, the maximum interacting SCFs are calculated for edge to edge gaps equal to hole sizes of 2.5a, 5a, 10a and 15a, where a is the hole radius. The analytical results are validated by 2-D finite element calculations. The presented simple approach provides good results with errors well below 10% in most cases compared to the detailed finite element analyses. Fatigue notch factors that can be thought of as the effective SCFs in fatigue analyses are determined. By using the simple approach, computationally costly finite element analysis can be avoided.

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“…Finally, an interesting observation regarding the singular nature of tangential stress, on a subsurface circular hole/cavity, at the point closest to half-plane boundary, as given in [2], is its h -0.5 singularity (where "h" is the thin ligament joining circular hole and half-plane). Similar behaviour for tangential stress on hole boundary in a thin ligament joining two circular holes is given in [3]. It will be interesting to evaluate the nature in which hoop stress becomes unbounded on the face of arc crack at the point that is closest to the half-plane, with respect to arc crack angle as well as elastic mismatch.…”

Section: Discussionmentioning

confidence: 70%

“…Also, the singular nature of hoop stress on hole boundary resembles that of a crack tip in the limit of 'd' becoming zero. Wu and Markenscoff [3] examined the problem of two circular holes separated by some distance. They too obtained inverse square root singularity for hoop stress (at points on hole boundaries where the distance between the two holes is minimum) as the ligament between two holes becomes very thin (two holes are very close to each other).…”

Section: Introductionmentioning

confidence: 99%

“…In this work, we examine the role of half-plane on SIF's of an arc crack at the interface of sub-surface circular elastic inclusion. The current work is therefore a generalization to references [1][2][3][4]. The objective here is not to study hoop stress variation on the inclusion boundary but to understand the effect of half-plane on SIF variation at arc crack tips.…”

Section: Introductionmentioning

confidence: 99%

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Interfacial Cracks Emanating from Partially Debonded Subsurface Circular Elastic Inclusions

Prasad¹

Fracture of Nano and Engineering Materials and Structures

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The problem of a sub-surface circular elastic inclusion with single interfacial debond in plane elasticity is considered in the present work. The sub-surface defect is modeled as elastic circular inclusion lying at some distance from the free surface. The presence of such defects is critical to the life of components subjected to high contact stresses. The question of the presence of free boundary on the stress intensity factors (SIF) of interfacial arc crack under remote uniform stress fields is addressed in this study. By varying the elastic modulus of inclusion, three cases of elastic mismatch are considered: 1) inclusion is hard corresponding to sub-surface rigid inclusion, 2) inclusion is soft corresponding to sub-surface hole, 3) and, inclusion has same material properties as surrounding matrix (equivalent to sub-surface arc crack in elastic half-plane). Half plane is simulated by means of long crack in the vicinity of the circular elastic inclusion so that half-plane boundary conditions are represented locally. Singular integral equation is setup to simulate half-plane boundary. SIF at arc-crack tip closest to the half-plane is evaluated to study its variation as the inclusion approaches half-plane.

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Singular stress amplification between two holes in tension

Abstract: The singular stress amplification in either longitudinal on transverse tension in the ligament between two holes has been obtained by using a new singular asymptotic expansion for series.

Cited by 13 publications

References 19 publications

Stress Magnification due to Stretching and Bending of Thin Ligaments between Voids

Stress Magnification due to Stretching and Bending of Thin Ligaments between Voids

A Stress concentration factor for interacting surface notch and subsurface hole

Interfacial Cracks Emanating from Partially Debonded Subsurface Circular Elastic Inclusions

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