Sinterability and conductivity of silver paste with Pb-free frit

Seo, Dong Seok; Park, S.H.; Lee, J.K.

doi:10.1016/j.cap.2008.08.011

Cited by 40 publications

(10 citation statements)

References 5 publications

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“…[13] For example, NiÀAg coreÀshell NPs with the surface characteristics of Ag and the magnetic properties of Ni have potential applications in the electronic, optical, magnetic, catalytic, and biomedical fields. This is made possible by the fact that Ag NPs have high thermal and electrical conductivities and are also highly resistant to oxidation, even at the nanometre scale, [14] meaning that coating Ag shells on Ni NPs can effectively prevent the oxidisation of the Ni cores. For these reasons, NiÀAg coreÀshell NPs could be used as electrode materials instead of Ag NPs in a conductive paste.…”

Section: Introductionmentioning

confidence: 99%

Preparation of nickel–silver core–shell nanoparticles by liquid-phase reduction for use in conductive paste

Jing

Xie

Chen

et al. 2015

Journal of Experimental Nanoscience

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Section: Introductionmentioning

confidence: 99%

Preparation of nickel–silver core–shell nanoparticles by liquid-phase reduction for use in conductive paste

Jing

Xie

Chen

et al. 2015

Journal of Experimental Nanoscience

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“…[5][6][7][8][9][10] reported that the preparation of ultrafine silver powder using ascorbic acid as reducing agent and its application in multi-layer chip inductor (MLCI). Jeon 12 optimized the lead-and cadmium-free front contact silver paste formulation.…”

Section: Introductionmentioning

confidence: 99%

Optimization of viscosity and thixotropy for organic medium to achieve high photovoltaic conversion efficiency of silicon solar cells

Zhang

Cui

Wang

2013

Journal of Renewable and Sustainable Energy

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The properties of the silver paste have great influence on the photovoltaic conversion efficiency (Eff) of monocrystalline silicon (Si) solar cells. The organic medium is a very important part of silver paste. In this paper, two main performance parameters of organic medium (viscosity and thixotropic index) are systematically studied. When the thixotropic index of the organic medium is more than 5.50 and the viscosity is between 15 pa·s and 30 pa·s, the silver paste has good thixotropy and appropriate printability. The experimental results indicate that organic medium has appropriate viscosity (20 pa·s) and the highest thixotropic index (9.35) when its composition is as follows: solvents 80.00 wt. %, thickener 3.00 wt. %, thixotropic agents 8.00 wt. %, surfactant 3.00 wt. %, and coupling agent 6.00 wt. %. The silver paste shows appropriate viscosity (270–370 pa·s), high thixotropic index (6.50), and good printability when the percentage of organic medium is about 12.00 wt. %. Using this silver paste, the front electrode grid of Si solar cells has high ratio of height to width as well as fine edge definition. Meanwhile, the Eff of monocrystalline Si solar cells reach 18.29%.

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“…[1][2][3][4][5] Compared with conventional tin-lead solders, the ECAs possess many advantages, such as environmental friendliness, finer pitch printing, lower temperature processing and more flexible and simpler processing. [3][4][5][6][7][8] However, complete replacement of soldering by ECAs is yet not possible owing to several limitations of ECAs which are mainly related to reliability aspects like limited impact resistance, unstable contact resistance, low adhesion and conductivity etc.…”

Section: Introductionmentioning

confidence: 99%

Influence of curing procedures on the electrical properties of epoxy-based isotropic conductive adhesives

Xiong

et al. 2014

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction M

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In this paper, a typical isotropic conductive adhesives (ICAs) composed of an epoxy-based binder containing micro-sized silver flakes was prepared and the effects of different curing procedures on the electrical properties of conductive adhesives were investigated. The results showed that there a greater influence of the curing temperature on 55% silver fill loading, the volume resistivity of ICAs decreased to 4.7×10 -3 from 1.0×10 -3 cured at 180 0 C and 250 0 C, respectively. However, there is almost no effect on the high silver fill loading. The in situ monitoring the variations in electrical resistance of ICAs with 65% silver fill loading was studied during the curing process, and 180 0 C after cured for 27 electrical resistance of ICAs. The reasons for the dependence of bulk resistivity on temperatures were also discussed in terms of the dispersing of the silver flakes in ICAs by SEM.

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Sinterability and conductivity of silver paste with Pb-free frit

Cited by 40 publications

References 5 publications

Preparation of nickel–silver core–shell nanoparticles by liquid-phase reduction for use in conductive paste

Preparation of nickel–silver core–shell nanoparticles by liquid-phase reduction for use in conductive paste

Optimization of viscosity and thixotropy for organic medium to achieve high photovoltaic conversion efficiency of silicon solar cells

Influence of curing procedures on the electrical properties of epoxy-based isotropic conductive adhesives

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