Sintering process of silver nanoparticles in ink-jet printed conductive microstructures - Molecular dynamics approach

Fałat, Tomasz; Płatek, Bartosz; Felba, Jan

doi:10.1109/esime.2012.6191782

Cited by 11 publications

(7 citation statements)

References 5 publications

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“…One of the most frequently used sintering methods is the thermal treatment of material. It is known that both the temperature and the time of such treatment is crucial in sintering process [9,10]. Proper conditions of this process enable one to obtain desired characteristics of the printed patterns, which is often important from the application point of view.…”

Section: Introductionmentioning

confidence: 99%

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The Influence of Sintering Conditions on the Inkjet Printed Paths Resistance

Tomaszewski¹,

Wałach²,

Potencki³

et al. 2016

International Journal of Electronics and Telecommunications

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Abstract-The sintering of elements performed with the inkjet printing technique is one of the stages of flexible printed circuit manufacturing process. It is a crucial factor to determining the printed paths conductivity playing often an important role in the printed circuit. In this paper the study of the influence of thermal sintering conditions (temperature, time) on the resistance of paths made with inkjet printing on flexible substrates by using two electrically conductive inks was presented. The results of the investigations show that the sintering temperature is the main factor determining the paths resistance. Therefore, in some applications the sintering temperature higher than the one specified by the ink manufacturer can be used to decrease the paths resistance and to improve some circuit parameters. However, it should be noticed that the effective resistance decrease occurs only up to a certain temperature due to the appearance cracks in the printed paths.

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Section: Introductionmentioning

confidence: 99%

“…caused by the particles recrystallization and formation of larger nanosized structures [10,12]. For many commercially available inks with silver nanoparticles having a size up a dozen or so nanometers, the third stage starts within 60 minutes when the process temperature is higher than 200°C [6].…”

mentioning

confidence: 99%

The Influence of Sintering Conditions on the Inkjet Printed Paths Resistance

Tomaszewski¹,

Wałach²,

Potencki³

et al. 2016

International Journal of Electronics and Telecommunications

View full text Add to dashboard Cite

show abstract

“…After depositing, the nanoparticle inks require a thermal post-treatment to enable the solvent to evaporate and to achieve good electrical conductivity by initializing a sintering of the particles [11]. Oven sintering is mainly used for this process in printed electronics.…”

Section: Printing Of 3d Conductive Patternsmentioning

confidence: 99%

Approaches for Additive Manufacturing of 3D Electronic Applications

et al. 2014

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Additive manufacturing processes typically used for mechanical parts can be combined with enhanced technologies for electronics production to enable a highly flexible manufacturing of personalized 3D electronic devices. To illustrate different approaches for implementing electrical and electronic functionality, conductive paths and electronic components were embedded in a powder bed printed substrate using an enhanced 3D printer. In addition, a modified Aerosol Jet printing process and assembly technologies adapted from the technology of Molded Interconnect Devices were applied to print circuit patterns and to electrically interconnect components on the surface of the 3D substrates.

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“…In the literature there are numerous studies on thermal and electrical sintering effects of silver NP-based printed structures in terms of electrical resistance [36]- [38] or morphology [39]- [41]. Concerning the characterization of printing techniques for RF and microwave applications, there are some reports on cooper and silver-based inkjet-printed structures such as planar transmission lines [42]- [48], split-ring resonators [49] and other passive RF structures [50], as well as printed antennas for RFID applications [8], [51]- [56].…”

Section: Introductionmentioning

confidence: 99%

Comparative Study of Inkjet-Printed Silver Conductive Traces With Thermal and Electrical Sintering

et al. 2019

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Thermal sintering has traditionally been the most popular sintering method to enhance conductivity after the printing process in the manufacturing of printed electronics. Nevertheless, in recent years, there has been a growing interest in electrical sintering as an alternative method to overcome some of the limitations of thermal curing. This paper makes a comparative study of both sintering methods in terms of surface morphology, electrical dc conductance, and radiofrequency performance for different applied voltage waveforms. To this end, microstrip transmission lines have been inkjet-printed using nanoparticle-based silver ink on flexible polyimide substrate. The traces have been tested under different sintering conditions, achieving electrical sintering resistivity values only 2.3 times higher than that of bulk silver. This implies a 62% reduction in comparison with the best resistivity value achieved using thermal sintering in our samples. The main novelty of this contribution lies in the analysis of RF behavior as a function of electrical sintering conditions. Lower resistivities have been achieved with slower voltage ramps or allowing higher density current during sintering. It has also been proved that electrically sintered lines have similar RF performance than high-temperature thermally sintered lines in terms of insertion losses, regardless of their very different surface topology. Therefore, we can take advantage of the benefits that electrical sintering offers over thermal sintering regarding significant shorter sintering times maintaining suitable RF performance.INDEX TERMS Electrical sintering, inkjet printing, microstrip transmission line, silver nanoparticle ink, thermal sintering.

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Sintering process of silver nanoparticles in ink-jet printed conductive microstructures - Molecular dynamics approach

Cited by 11 publications

References 5 publications

The Influence of Sintering Conditions on the Inkjet Printed Paths Resistance

The Influence of Sintering Conditions on the Inkjet Printed Paths Resistance

Approaches for Additive Manufacturing of 3D Electronic Applications

Comparative Study of Inkjet-Printed Silver Conductive Traces With Thermal and Electrical Sintering

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