Sintering, Properties and Fabrication of Si3N4 + Y2O3 Based Ceramics

Quackenbush, C. L.; Smith, Jim Q.; Neil, J. T.; French, K. W.

doi:10.1007/978-94-009-6851-6_57

Cited by 15 publications

(4 citation statements)

References 10 publications

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“…Hence, additives such as Y203, which give a higher viscosity grain boundary phase, generally result in lower creep rates than for MgO-doped silicon nitride [20]. However, a second oxide additive, A1203, is frequently combined with ^203, to avoid problems of reduced densification rates and higher densification temperatures, produced by -T the single refractory oxide additive [21,22].…”

mentioning

confidence: 99%

The high temperature creep deformation of Si3N4-6Y2O3-2Al2O3

Todd

1989

J Mater Sci

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The creep properties of silicon nitride containing 6 wt% yttria and 2 wt% alumina have been determined in the temperature range 1573 to 1673 K. The stress exponent, n, in the equation e « a , was determined to be 2.00 +_0.15 and the true activation energy was found to be 692 +_ 25 kJ mol~. Transmission electron microscopy studies showed that deformation occurred in the grain boundary glassy phase accompanied by microcrack formation and cavitation. The steady state creep results are consistent with a diffusion controlled creep mechanism involving nitrogen diffusion through the grain boundary glassy phase.

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confidence: 99%

The high temperature creep deformation of Si3N4-6Y2O3-2Al2O3

Todd

1989

J Mater Sci

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“…We previously reported that the BAM paste containing commercial BYK111, which has phosphoric acid as an anchoring group, shows rheological behaviors similar to those of the paste with OPE10–COOH 13. However, neat BYK111 produces 7.08 wt % residual char at high temperatures in air,12 and this lowers the PL intensity of the corresponding BAM film compared to the film prepared from the paste with OPE10–COOH (Fig.…”

Section: Resultsmentioning

confidence: 89%

“…Especially in the PDP manufacturing process, complete debinding of any organics is necessary to avoid harmful defects such as charred residues deposited on the phosphor surface. These kinds of defects caused by improper selection of organics are impossible to heal by subsequent sintering 13…”

Section: Resultsmentioning

confidence: 99%

Plasma display material prepared from a new blue phosphor dispersion

Lee

Byun

et al. 2008

J of Applied Polymer Sci

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An improved coating having a high concentration of blue phosphor powder was made with a modified Triton X-100 dispersant. The barium magnesium aluminate phosphor was very well dispersed in terpineol if the Triton (octyl phenol ethoxylate) had terminal carboxylic acid groups, which had been added to the Triton molecule by chemical synthesis. This improved dispersion was screenprinted, dried, and then sintered. Because of the very tight packing of the phosphor particles, the photoluminescence intensity of the phosphor film in vacuum ultraviolet excitation was significantly increased up to 10.23%.

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“…In some ceramic body fabrication processes (e.g., injection molding) the "binder removal" stage can be the most critical step in the process (64). Recently, a number of studies have been reported (64)(65)(66)(67)(68)(69) where oxidative and thermal degradation mechanisms were employed to carry out the removal of processing additives. Temperature history (initial and final temperature, '.iing rate), polymer chemistry, furnace atmosphere, and ceramic powder microstructure were demonstrated to play important roles in the process.…”

Section: Removal Of Processing Aidsmentioning

confidence: 99%