Size-Controlled Oxidation-Resistant Copper Fine Particles Covered by Biopolymer Nanoskin

Abstract

Size-controlled oxidation-resistant copper fine particles were prepared from insoluble CuO micron-sized particles. The particle sizes were quite uniform and could be varied only by the concentration of the complex reagent from 45 to 175 nm. No template material was needed for size control. Gelatin was selected as the protective polymer. Addition of protease after formation of copper fine particles decomposed preferentially loop and tail parts of gelatin. The remaining nanoskin gelatin layer, covered on the particle surface, prevents oxidation of copper.

Preparation of Copper Nanoparticles in Liquid by Matrix Sputtering Process

“…[5][6][7] In most cases, recently, especially in laboratories, MNP dispersions were prepared by chemical reduction or decomposition of the corresponding metal compounds by using external reduction agents or solvents. [1,[8][9][10] Initial cost of wet chemical processes is usually much smaller than vacuum processes and the particle sizes can be controlled by the selection of metal sources, protective reagents, reducing reagents as well as their concentrations.…”

New routes to Cu(i)/Cu nanocatalysts for the multicomponent click synthesis of 1,2,3-triazoles

“…36 In the case of monometallic Cu NPs, the prevailing structure-type noted has hitherto been Cu(core) @CuO/Cu 2 O(shell), 37 with efforts to control the formation of an oxide shell predicated on the use of capping agents that inhibit molecular access to the particle surface. [38][39][40] More recently, it has been shown that the use of polymeric capping agents may enhance the oxidative stability of NPs whilst permitting substrate access and efficient catalysis. 41 Moreover, the range of polymers available for stabilizing highly reactive main group nanomaterials has also very recently been extended through the use of poly(methyl methacrylate) (PMMA) to protect Mg nanocomposites.…”

Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions

“…Copper nanoparticles and fine particles have been drawing extensive interest according to their potential applications91011121314. Copper inks and pastes, which have a lower cost, excellent electrical resistivity (1.7 × 10 −8  Ω·m which is similar to silver) and higher electro-migration resistance, have attracted significant interest13141516171819202122.…”