2007
DOI: 10.1063/1.2801520
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Size-dependent thermal instability and melting behavior of Sn nanowires

Abstract: Thermal instability and melting behavior of tin nanowires were studied with a decrease of wire radius(rNW=7–30nm) via differential scanning calorimetry (DSC). Two sequential DSC measurements showed a 1∕rNW dependency of the melting temperature depression; the first melting temperature decreased from 502to486K with 1∕rNW whereas the second one was more depressed between 0.8 and 5K. The melting temperature difference between the first and second cycles increased linearly with 1∕rNW. This variation was attributed… Show more

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Cited by 80 publications
(68 citation statements)
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“…Our results agree well with Lai [9] and Wronski et al [10]. Shin and friends [11] reported the size-dependence of melting points of tin nanowires. They have found that the melting point of Sn nanowire 60 nm in diameter is 229…”
Section: Resultssupporting
confidence: 83%
See 1 more Smart Citation
“…Our results agree well with Lai [9] and Wronski et al [10]. Shin and friends [11] reported the size-dependence of melting points of tin nanowires. They have found that the melting point of Sn nanowire 60 nm in diameter is 229…”
Section: Resultssupporting
confidence: 83%
“…• C. We got improved results than Shin's et al [11]. So these nanowires can be applied in electronic application without altering the processing temperature.…”
Section: Resultsmentioning
confidence: 74%
“…44 In reality, the morphological instabilities of a solid wire are slightly more complicated but the overall trend that is experimentally observed still remains the same. 15,16,45 For instance the average distance between Ag nanoparticles in Fig. 1e is about 750 nm, a value larger but of the same order of magnitude as 2πR (330 nm) (the difference stemming from the substrate influence, the fivefold twin structure of the wire as well coalescence which occurs after spheroidization).…”
Section: Spheroidizationmentioning
confidence: 99%
“…[15][16][17][18] This is the result of a morphological instability, called the Rayleigh instability, and is a critical issue for the long-term reliability of micro-and nanoelectronic devices. These thermal instabilities place limitations on the thermal budget that an electrode may undergo during device fabrication.…”
Section: Introductionmentioning
confidence: 99%
“…This is a case of classical interfacial instability when dealing with liquid or solid cylinders when heated, called the Plateau-Rayleigh instability [127]. The morphological evolution of metallic NWs have been intensively investigated recently for Au [128], Cu [129], Pt [130], Sn [131], or Ag [132]. In a simple approach, perturbations with wavelengths larger than the original cylinder diameter become unstable.…”
Section: Thermal Propertiesmentioning
confidence: 99%