Size effect on microstructure and tensile properties of Sn3.0Ag0.5Cu solder joints

Wang, Shaobin; Yao, Yao; Long, Xu

doi:10.1007/s10854-017-7706-8

Cited by 17 publications

(6 citation statements)

References 25 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Instead, there was a threshold value of δ = 30 μm for solder thickness, and the initial growth rate of IMC in thinner solder joints (δ < 30 μm) was greater than that of thicker solder joints (δ > 30 μm), but the former decreased and the latter increased with an increasing aging time [30]. The size-dependent IMC growth rate was also reported by Wang et al [31]. Based on both solid-state and liquid-state diffusions, they found that the commonly reported size-dependent IMC growth rate may be only valid under a liquid-state diffusion, but invalid under a solid-state diffusion.…”

Section: Imc Formation and Growthsupporting

confidence: 74%

“…2019, 9, x FOR PEER REVIEW 5 of 15 effect in line-type or bi-lateral solder joints, which slows down the IMC growth, is speculated to be the dominant mechanism for such a negative k value. The constraint effect on the IMC growth can be seen in Figure 4, where the solder joints with small gap sizes (50 and 150 μm) only form thin lamellartype IMCs instead of scallop-type IMCs, which have been observed in the other three types of solder joint [31]. From the interaction point of view, the IMC growth rate is dominated by the Cu diffusion.…”

Section: Imc Formation and Growthmentioning

confidence: 87%

“…Li et al [47] investigated the joint gap size effects on the tensile properties of Cu/Sn0.7Cu0.05Ni/Cu solder joints by experiments and simulations. Wang et al [31] conducted tensile tests on Cu/Sn3.0Ag0.5Cu/Cu solder joints with gap sizes ranging from 50 to 2000 µm, and they found that the tensile strength increased as the joint gap decreased, and the stress triaxiality was used to explain the higher strength of joints with smaller gaps. Qin et al [48] performed microscale tensile tests of Ni/Sn3.0Ag0.5Cu/Ni and Cu/Sn3.0Ag0.5Cu/Cu solder joints with thickness-to-diameter ratios (R) from 1/3 to 1/12 by a dynamic mechanical analyzer (DMA).…”

Section: Tensile Behavior Of Solder Jointmentioning

confidence: 99%

“…Cu6Sn5 IMCs at the interfacial layers of line-type Cu/Sn3.0Ag0.5Cu/Cu solder joints after reflow and 210 °C aging for 6 h[31]. (Reused with permission).…”

mentioning

confidence: 99%

See 3 more Smart Citations

Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging

2019

Self Cite

View full text Add to dashboard Cite

With the miniaturization of electronic packaging and devices, the size of solder joints in electronics is also decreasing from bulk solder joints to micro-bumps. Both the microstructure and mechanical properties of the solder joints are also evolving with the decreasing size, which brings great concern for the reliability of different sizes of solder interconnections. In this paper, the effect of solder size on the microstructure (i.e., interfacial intermetallic compound (IMC) growth, precipitation in the solder matrix, dendrite arms, and undercooling) and mechanical properties (i.e., tensile property, shear and compression strength, fracture toughness, and creep deformation) are reviewed from the mechanical point of view. In addition, some areas for further researches about size effects on solder joints are discussed.

show abstract

Section: Imc Formation and Growthsupporting

confidence: 74%

Section: Imc Formation and Growthmentioning

confidence: 87%

Section: Tensile Behavior Of Solder Jointmentioning

confidence: 99%

“…Cu6Sn5 IMCs at the interfacial layers of line-type Cu/Sn3.0Ag0.5Cu/Cu solder joints after reflow and 210 °C aging for 6 h[31]. (Reused with permission).…”

mentioning

confidence: 99%

See 2 more Smart Citations

Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging

2019

Self Cite

View full text Add to dashboard Cite

show abstract

“…The development of three-dimensional integrated circuit (3D IC) packaging technology [8,9,10,11], has caused the solder interconnect to downsize to balls of diameter lesser than 50 µm. Moreover, the Cu 6 Sn 5 IMC growth related to this size effect poses a serious reliability concern [12,13,14,15,16,17]. Any study providing relationship between solder volume and intermetallics compound, can be added in contributing for the reliability enhancement of solder joints.…”

Section: Introductionmentioning

confidence: 99%

Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface

Shang

Kunwar

Wang

et al. 2019

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

The growth behaviour of Cu 6 Sn 5 intermetallic compound (IMC) at the solder height controlled post-spread Sn/Cu interface is investigated for different initial solder ball volumes, reflow temperatures and cooling rates. Because of the limited solder thickness at the periphery, the IMC retains a preferential scalloped morphology, even after cooling. For solder balls of initial diameters of 500, 1000 and 1700 µm, with the maximum solder height at the peripheral regime not exceeding 150 µm, reflowed at 250 ℃ and undergoing air cooling, it has been revealed that IMC characterized with larger layer thickness and grain diameter, correspond to the sample of smaller ball size. The increase in reflow temperature for a solder of initial size of 500 µm, is characterized by the increase in IMC thickness, developments of few but quite large faceted planes over the original scalloped morphology and non-uniformity in the grain diameter. In contrary the to air cooling (cooling rate 4.0 K/s), the IMCs obtained at the thin film zone, for furnace cooling (cooling rate = 0.037 K/s), are very larger, both in grain size and layer thickness. Moreover, the scalloped Cu 6 Sn 5 surface in furnace cooled specimens, bear many but tiny

show abstract

Atomic scale investigation of interfacial damage initiation in SnPb alloy: structural stability and defect-interface interactions

Xing,

Wang,

Jiang

et al. 2024

J Mater Sci

View full text Add to dashboard Cite

Size effect on microstructure and tensile properties of Sn3.0Ag0.5Cu solder joints

Cited by 17 publications

References 25 publications

Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging

Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging

Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface

Atomic scale investigation of interfacial damage initiation in SnPb alloy: structural stability and defect-interface interactions

Contact Info

Product

Resources

About