2015
DOI: 10.1063/1.4913601
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Size effects in the thermal conductivity of gallium oxide (β-Ga2O3) films grown via open-atmosphere annealing of gallium nitride

Abstract: Gallium nitride (GaN) is a widely used semiconductor for high frequency and high power devices due to of its unique electrical properties: a wide band gap, high breakdown field, and high electron mobility. However, thermal management has become a limiting factor regarding efficiency, lifetime, and advancement of GaN devices and GaN-based applications. In this work, we study the thermal conductivity of beta-phase gallium oxide (β-Ga2O3) thin films, a component of typical gate oxides used in such devices. We use… Show more

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Cited by 47 publications
(18 citation statements)
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“…For example, thinning down the material can enhance the phonon-boundary scattering resulting in better thermal transport. [245][246] However, this is an emerging field and more studies on phonon scattering in gallium oxide and at the interfaces will be of paramount importance.…”
Section: Poor Thermal Conductivitymentioning
confidence: 99%
“…For example, thinning down the material can enhance the phonon-boundary scattering resulting in better thermal transport. [245][246] However, this is an emerging field and more studies on phonon scattering in gallium oxide and at the interfaces will be of paramount importance.…”
Section: Poor Thermal Conductivitymentioning
confidence: 99%
“…1.2. In the past, thermal conductivities of doped and undoped bulk and thin film b-Ga 2 O 3 samples were measured at different temperatures using techniques such as 3x and TDTR [206][207][208]. Thermal conductivities of 300-1000 nm thick AlN thin films obtained using 3x technique are measured to be between k ¼ 5.4-17.7 W/mÁK [209].…”
Section: Galliummentioning
confidence: 99%
“…The oxide layer, which forms over the surface of Galinstan microstructures in the presence of DI water, has a thermal conductivity of 8.8 ± 3.4 W m −1 K −1 , which is lower than that of Galinstan, and therefore suppresses the heat transfer over the surface. However, the thickness of the oxide layer is in the range of 0.7–3 nm, which minimizes its thermal effect.…”
Section: Enabling 3d Microstructures For Enhancing Heat Dissipationmentioning
confidence: 99%