Size effects of a portable two-phase electronics cooling loop

Saenen, Tom; Baelmans, Martine

doi:10.1016/j.applthermaleng.2012.08.048

Cited by 9 publications

(3 citation statements)

References 35 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The need for solutions able to deal with such high heat fluxes has motivated the investigation of a huge variety of methods and technologies for heat transfer enhancement [2]. Solutions based on liquid [3] and two-phase [4,5] flows have been proved to be effective in dissipating large heat fluxes.…”

Section: Introduction and Motivationsmentioning

confidence: 99%

Convective heat transfer enhancement by diamond shaped micro-protruded patterns for heat sinks: Thermal fluid dynamic investigation and novel optimization methodology

Ventola

Dialameh

Fasano

et al. 2016

Applied Thermal Engineering

View full text Add to dashboard Cite

In the present work, micro-protruded patterns on flush mounted heat sinks for convective heat transfer enhancement are investigated and a novel methodology for thermal optimization is proposed. Patterned heat sinks are experimentally characterized in fully turbulent regime, and the role played by geometrical parameters and fluid dynamic scales are discussed. A methodology specifically suited for micro-protruded patterns optimization is designed, leading to 73 % enhancement in thermal performance respect to commercially available heat sinks, at fixed costs. This work is expected to introduce a new methodological approach for a more systematic and efficient development of solutions for electronics cooling.

show abstract

Section: Introduction and Motivationsmentioning

confidence: 99%

Convective heat transfer enhancement by diamond shaped micro-protruded patterns for heat sinks: Thermal fluid dynamic investigation and novel optimization methodology

Ventola

Dialameh

Fasano

et al. 2016

Applied Thermal Engineering

View full text Add to dashboard Cite

show abstract

“…Thanks to the works of Bejan [45][46][47] on entropy generation minimisation (EGM), awareness of the importance and potential of the second law in the analysis of the performance of heat exchangers grew, giving rise to several works and different techniques, a review of which can be found in [48]. More recently, researchers have dealt with the optimisation of micro heat exchangers [49][50][51] in terms of the first and second law, with new and interesting results obtained when conjugate effects are considered. An extensive body of work on the combined use of PEC and EGM has been produced by Zimparov, who extended the former method [52,53] and co-authored [54,55] with some recent contributions where the relative performance of different cross-sections under laminar flow conditions and either H or T boundary conditions are studied: see [56] for further references.…”

Section: Introductionmentioning

confidence: 99%

Combined Geometrical Optimisation of a Square Microchannel with Smoothed Corners

Lorenzini,

Suzzi

2024

Energies

View full text Add to dashboard Cite

Several engineering systems currently use microchannel heat sinks. In order to increase the performance of these devices, optimisation according to the first and second law of thermodynamics is employed. One way to achieve the goal is to modify the geometry of the cross-section, as is done in this paper for square ducts, having the walls at a uniform temperature which is higher than that of the bulk fluid at the inlet. The effects of both the thermal entry region of the duct and the heat generation due to viscous dissipation are considered. The resulting Graetz–Brinkman problem is solved numerically to obtain the velocity and temperature fields. It is demonstrated that non-negligible viscous heating eventually causes the heat flux to reverse (from fluid to walls), and that, only after this condition is achieved, can the flow become fully developed, which makes the entry region the only useful stretch for real-life applications. The length after which the direction of the heat flux reverses due to viscous heating in the fluid is obtained as a function of the Brinkman number and of the smoothing radius. Optimisation with performance evaluation criteria and entropy generation minimisation was carried out separately, and the results were combined into a single objective function. A comparison with published models highlights how neglecting the entry region and viscous heating yields misleading results. It turns out that smoothing the corners is always profitable in the case of the constrained heated perimeter or area of the cross-section but seldom when the characteristic length or the hydraulic diameter is fixed. With few exceptions, viscous heating amplifies the trends experienced for zero-Brinkman flows. The results are in non-dimensional form, yet they have been obtained starting from plausible dimensional values and are applicable to real-life devices.

show abstract

“…The performance and reliability of electronic components and assemblies strongly depend on their thermal state and characteristics [1][2][3]. In electronics, natural convection is the preferred heat transfer mode, given its numerous advantages.…”

Section: Introductionmentioning

confidence: 99%

Thermal state of electronic assemblies applied to smart building equipped with QFN64 device subjected to natural convection

Baı̈ri

Roseiro

Martín-Garín

et al. 2017

Microelectronics Reliability

View full text Add to dashboard Cite

The performance and reliability of electronic components and assemblies strongly depend on their thermal state. The knowledge of the temperature distribution throughout the assembly is therefore an essential element to ensure their correct operation. This is the main objective of this work that examines the case of a conventional assembly equipped with a quad flat non-lead QFN64 subjected to free convection. This active electronic package is welded on a PCB which may be inclined by an angle varying between 0°and 90°(horizontal and vertical positions respectively) and generates during its operation a high power ranging from 0.1 to 1 W. Thermoregulation of the assembly is ensured by natural convection, given its many well known advantages in this engineering field. Accurate relationships are proposed to determine the temperature on different areas of the device and the PCB. They are determined by means of a 3D numerical approach based on the finite volume method confirmed by measurements on an actual installation. These relationships allow reliability improvement of these electronic assemblies that are widely used in many engineering fields such as computing industry, mobile telephony, home automation, automotive, embarked electronics and the smart building applications considered in this work. The present survey complements a recent study which quantifies the natural convective heat transfer on the considered electronic assembly equipped with the QFN64 device, for the same power range and angle of inclination.

show abstract

Size effects of a portable two-phase electronics cooling loop

Cited by 9 publications

References 35 publications

Convective heat transfer enhancement by diamond shaped micro-protruded patterns for heat sinks: Thermal fluid dynamic investigation and novel optimization methodology

Convective heat transfer enhancement by diamond shaped micro-protruded patterns for heat sinks: Thermal fluid dynamic investigation and novel optimization methodology

Combined Geometrical Optimisation of a Square Microchannel with Smoothed Corners

Thermal state of electronic assemblies applied to smart building equipped with QFN64 device subjected to natural convection

Contact Info

Product

Resources

About