Size reduction of MMIC packages using compression approach simulations

Lesage, Jean-Marc; Loison, Renaud; Gillard, Raphaël; Barbier, T.; Mancuso, Y.

doi:10.1109/eumc.2005.1608902

Cited by 5 publications

(1 citation statement)

References 2 publications

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“…By reducing the cover height, the small package can be implemented. But the mutual coupling of the package inside can be increased and degradation of the gain of MMIC and isolation can be generated by reducing the cover height [10]. The minimum cover height that does not deteriorate the performance of MMIC presented at the reference [10] was 600 m. In our design, the h 1 was also designed as 600 m by using the six-layer LTCC cover having a three-layer cavity.…”

Section: Ltcc Package Designmentioning

confidence: 99%

Low loss DC to 50 GHz LTCC SMT package for millimeter wave MMICs

Yom

2007

Micro & Optical Tech Letters

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The new vertical transition using the trough line, the slab line, and shielded multilayer coplanar waveguides (SMCPW) in order to implement the DC ∼ 50‐GHz band low loss LTCC hermetic surface mounting (SMT) MMIC package was developed. The trough line, the slab line, and the SMCPWs were employed in order to minimize the discontinuity of the conventional via vertical transition, and the radiation loss and crosstalk. The proposed vertical transition is constructed using the multiple transmission lines of the SMCPW1–trough line–slab line–SMCPW2–SMCPW3. The manufactured LTCC hermetic SMT MMIC package showed a low insertion loss less than 0.6 dB and a reflection loss less than −20 dB in the frequency range from DC to 53 GHz. © 2007 Wiley Periodicals, Inc. Microwave Opt Technol Lett 50: 24–29, 2008; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.22973

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Section: Ltcc Package Designmentioning

confidence: 99%