Recent advances in wearable sensor technologies have established a foundation for active and accurate measurement of physiological signals for prophylaxis and prediagnosis. [1][2][3][4][5][6] The flexible and stretchable mechanical properties of these sensors enable conformal interfaces to curvilinear surfaces of the body and continuous collection of healthcare-related data without irritation. [7][8][9][10][11][12][13][14][15] Among their applications, wearable pulse oximetry has been successfully applied to monitor cardiac [16][17][18] and cerebral activities [19,20] by analyzing blood dynamics and measuring the heart rate. This type of skin-mountable optoelectronic device consists of a microscale inorganic light-emitting diode (µ-ILED) and inorganic photodetector (µ-IPD) based on AlInGaP and silicon. In this configuration, specific portion of the light emitted from the µ-ILED is absorbed and scattered by biological tissues; and the rest portion of the light is transmitted through the tissues and detected its intensity by the µ-IPD. The light intensity recorded via µ-IPD of the optoelectronic device can be used to monitor internal blood flow under the skin of various parts of the body, including peripheral locations of the neck, wrist, and forehead. [21][22][23] Despite the well-established advantages of robust contact and functional implementation of these optoelectronic systems, undesired heating of optoelectronics and subsequent thermal damage of the skin during device operation remain as critical engineering challenges. It has been reported that the low thermal conductivity of materials in the optoelectronic interface limit effective heat dissipation, thus resulting in thermal damage to biological tissue [24,25] and deterioration in µ-ILED functionality. [26][27][28]38] Despite the importance of temperature control for patient safety and device operation, materials and designs to manage temperature during device operation have been less well explored.In this study, we present materials and integration strategies of embedded metallic heat sink element in the optoelectronic device to effectively dissipate the heat generated by the µ-ILED and prevent harmful thermal damage, such as skin burn. A thin metal layer embedded under the µ-LED allows the device to maintain a low surface temperature, comparable to that of skin, via a thermally effective design based on theoretical/computational thermomechanics. Experimental resultsThe applications of modern optoelectronic devices have been extended, and they now provide practical means for seamless real-time monitoring of blood flow dynamics, by being integrated with flexible and stretchable wearable sensor platform technology. However, thermal management of these devices remains limited by undesired thermal energy originating from the heating of the light-emitting diode. Specifically, the surface temperature of the optoelectronic device becomes very high compared to that of the adjacent biological tissue, causing challenges in skin-optoelectronics integration and funct...