Slicing Ceramics on Material Removed by a Single Abrasive Particle

Abstract

Multi-wire saw machining (MWSM) used for slicing hard-brittle materials in the semiconductor and photovoltaic industries is an important and efficient material removal process that uses free abrasives. The cutting model of single-wire saw machining (SWSM) is the basis of MWSM. The material removal mechanism of SWSM is more easily understood than MWSM. A mathematical model (includes brittle fracture and plastic deformation) is presented in this paper for SWSM ceramic with abrasives. This paper determines the effect of various machining parameters on the removal of hard-brittle materials. For brittle fracture of SWSM ceramics, the minimum strain energy density is used as a fracture criterion. For plastic deformation of SWSM ceramics, the material removal is calculated using equations of motion. Actual wire-sawing experiments are conducted to verify the results of the developed mathematical model. The theoretical results agree with experimental data and practical experience. From the developed mathematical model, brittle fracture plays a major role in material removal of SWSM ceramics. Wire speed (S) and working load (P) are positively correlated with material removal of SWSM ceramics. The coefficient of friction is low, a lateral crack, which propagates almost parallel to the working surface, leads to more brittle fracture and material removal is increased.

Grey-Taguchi-Based Optimization of Wire-Sawing for a Slicing Ceramic

“…Bidiville et al [13] found that a low abrasive volume fraction in the slurry, a low wire tension, and a slow feed rate can obtain the strongest wafers in a slicing silicon wafer. Tsai et al [14] reported wire speed and working load are positively correlated with material removal of single-wire saw machining ceramics. A review of some papers on the system and process level investigations for both multi-wire slurry sawing and diamond wire-sawing is also presented in Reference [15].…”