2007 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference 2007
DOI: 10.1109/imoc.2007.4404238
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Small area cross type integrated inductor in CMOS Technology

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Cited by 5 publications
(10 citation statements)
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“…The original cross inductor, shown in Fig. 3(a), was presented in 2007 [9] as an innovative structure having a geometric design that minimizes area consumption on integrated circuit projects. This structure needs three metal layers to its implementation and its segments form two groups: the core and the connection segments.…”
Section: B Scalable Cross Inductormentioning
confidence: 99%
See 1 more Smart Citation
“…The original cross inductor, shown in Fig. 3(a), was presented in 2007 [9] as an innovative structure having a geometric design that minimizes area consumption on integrated circuit projects. This structure needs three metal layers to its implementation and its segments form two groups: the core and the connection segments.…”
Section: B Scalable Cross Inductormentioning
confidence: 99%
“…As explained, (8) and (9) work just over the low-frequency range, and, N is the amount of simulated data in the range, from DC to 5% f C , and are, respectively, the real and imaginary parts of each value of the inverse of serial admittance. From (8) and (9), C S , the capacitance between the inductor's metal segments, is:…”
Section: A Elements Value Extraction Proceduresmentioning
confidence: 99%
“…We believed that new geometries allow optimizations of the quality factor, of the inductance values and of the resonance frequencies without the need of alterations in the technology. This new developed structure is an evolution that is based on previous work of structures of planar inductors, such as: the vertical and, the zig-zag [2,3]. The cross inductor has two regions: the core, where the segments are crossed perpendicularly; and the external ring, where the segments are 45 • respect to the core segments, to close the loops among them.…”
Section: Theoretical Issues Of On-chip Planar Inductorsmentioning
confidence: 99%
“…Há várias soluções propostas para minimizar as perdas nos indutores, como o uso de materiais com alta condutividade nas trilhas das espiras [25] , substratos de alta resistividade à base de safira [26] , camadas metálicas de blindagem entre o indutor e o substrato [27] , porém, todas apresentam desvantagens, pois substratos de alta resistência encarecem o processo de fabricação, assim como o uso de proposto em 2007, Moreira et al [28] , para operar até a faixa de frequências de micro- [28] , bem como a extensão da arquitetura cross para permitir quantidades variáveis de trilhas.…”
Section: Contudounclassified
“…A dificuldade para extração dos parâmetros nestes modelos mais elaborados e a necessidade de produzir um modelo simples, que apenas estime os valores dos parâmetros do circuito equivalente levou ao desenvolvimento apresentado a seguir. planares, cuja arquitetura foi proposta em [28] , com o objetivo de reduzir a área ocupada e aumentar a indutância por área. Concebida originalmente para a tecnologia CMOS, cujos custos de produção são proporcionais à área ocupada, ainda é uma arquitetura nova e as poucas aplicações encontradas na literatura foram propostas por Moreira [18] [22] e Rios [37] .…”
Section: Descrição Dos Capítulosunclassified