Smart microchannel heat exchanger based on the adaptive deformation effect of shape memory alloys

Chu, Xia; You, Huihui; Tang, Xiaojin; Zhou, Wei; Li, Xinying; Yuan, Ding; Zhou, Shupan

doi:10.1016/j.enconman.2021.114910

Cited by 16 publications

(3 citation statements)

References 37 publications

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“…With the rapid development of the high-power and highheat-flux electronics industry, the heating power of electronic chips and devices is bound to increase continuously, and its thermal management technology will face greater challenges [213,214]. The development of existing heat dissipation technologies ranges from passive to active, from natural convection, forced air cooling to forced liquid cooling, and from single-phase heat dissipation to multiphase heat dissipation.…”

Section: Discussionmentioning

confidence: 99%

A comprehensive review on microchannel heat sinks for electronics cooling

Yu,

Li,

Cao

2024

Int. J. Extrem. Manuf.

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The heat dissipation density of electronic devices is increasing dramatically, which causes a serious heat bottleneck in electronics. Operating temperature over its rated temperature results in performance deterioration and even device damage. With the development of micro-machining technologies, microchannel heat sinks have become one of the best ways to remove the considerable amount of heat generated by the high-power electronics. It shows the advantages of large specific surface area, small size, saving coolant and high heat transfer coefficient. This paper comprehensively overviews the research progress in microchannel heat sinks and generalizes the hotspots and bottlenecks of this area. The heat transfer mechanisms and performances of different channel structures, coolants, channel materials and some other influence factors are reviewed. Besides, this paper classifies the heat transfer enhancement technology and reviews the related studies on both the single-phase and phase-change flow and heat transfer. The comprehensive review is expected to provide theoretical reference and technical guidance for further research and application of microchannel heat sinks in the future.

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Section: Discussionmentioning

confidence: 99%

A comprehensive review on microchannel heat sinks for electronics cooling

Yu,

Li,

Cao

2024

Int. J. Extrem. Manuf.

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“…Later, Regany et al [87] experimentally assessed the thermal improvement capacity of an array of SMA adaptive fins inside a liquid cooling channel, and demonstrated enhancements of 63% in the temperature uniformity and 50% in heat transfer increment due to the implementation of the adaptive fins (Figure 9). At the same time, Chu et al [88] investigated the application of an SMA coil as an adaptive vortex generator to alter the flow characteristics of a microchannel heat exchanger, allowing to increase the Nusselt number by 112% at a heat flux of 1 × 10 5 W/m 2 . Furthermore, the authors subsequently proposed employing graded SMA coils to intelligently recognize the location of hotspots and experimentally demonstrated better overall performance with this improved system to address random hotspots [89].…”

Section: Heat Transfer Regulation Through Flow Disruption Of Fluid Bo...mentioning

confidence: 99%

Perspective Chapter: Smart Liquid Cooling Solutions for Advanced Microelectronic Systems

Vilarrubí

2024

Heat Transfer - Advances in Fundamentals and Applications

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Thermal management is today a primary focus in the electronics industry due to the continuous increase of power density in chips increasingly smaller in size, which has become a critical issue in fast-growing industries such as data centers. As air-cooling fails to meet the high heat extraction demands of this sector, liquid cooling emerges as a promising alternative. Nevertheless, advanced microelectronic components require a cooling system that not only reduces the energetic consumption but also enhances the thermal performance by minimizing the thermal resistance and ensuring high-temperature uniformities, especially under variable heat load scenarios with high heat dissipating hotspot regions, where conventional liquid cooling solutions prove inefficient. This chapter provides an overview of different passive heat transfer enhancement techniques of micro heat sinks from the literature, focusing on intelligent and adaptive solutions designed to optimize the cooling performance based on local and instantaneous cooling requirements for non-uniform and time-dependent power distribution maps.

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“…Passive electronics cooling, such as a heat sink and heat pipe, can transfer the heat generated by a heat source component to a liquid medium, often air or a refrigerant where the heat is dissipated away from the device to allow or maintain the device's temperature at its designed operating temperature. There is a wide range of research done on thermal control devices, such as enhancing heat rejection with supercritical carbon carbide microchannel heat exchanger [5], shape memory alloy heat exchanger that improves the automatability of marching cooling capacity [6]. Structure design such as subcooled [7], two-phase stacked microchannel heat exchanger [8], working fluid, and materials [9] for the heat exchanger are always some popular topics for research.…”

Section: Introductionmentioning

confidence: 99%

Numerical Study on Heat Propagation in Laptop Cooling System

Sheng

Elfaghi

Afolabi

2022

ARFMTS

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Thermal management of microelectronic devices has become increasingly important to maintain their performance and prolonging the lifespan of the devices. In this study, numerical simulation has been conducted to investigate the heat propagation for high performance microelectronic device of laptop. Two models are constructed and Ansys Fluent is used for the Computational Fluid Dynamics (CFD) simulation, source term is applied at the heat source, heat sink and two different material heat pipes are the main cooling components in the system. The results show that the improved design model is a better design for laptop cooling systems, and the increasing number of air vents, thermal conductivity, and length of heat pipes can effectively cool the high-powered microchip effectively. Transient simulation, considering the wick structure and working fluid in the simulation, is suggested for future work.

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Smart microchannel heat exchanger based on the adaptive deformation effect of shape memory alloys

Cited by 16 publications

References 37 publications

A comprehensive review on microchannel heat sinks for electronics cooling

A comprehensive review on microchannel heat sinks for electronics cooling

Perspective Chapter: Smart Liquid Cooling Solutions for Advanced Microelectronic Systems

Numerical Study on Heat Propagation in Laptop Cooling System

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