Sn-3Ag-0.5Cuはんだの溶融過程におけるSb粉末溶解現象および接合部の信頼性評価

Fukuda, Atsushi; Yamada, Takayuki; BESSHI, Noriyuki; Kashiba, Yoshihiro

doi:10.7791/jspmee.3.192

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2019

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“…5,6) Generally, material properties of solder materials have been evaluated with the relative large size specimen specified in JIS Z 3198-2 in Japan. 7,8) The specimen is the dumbbell type and the diameter is 8 mm. Figures 1 and 2 show microstructures observation results for the JIS Z 3198-2 specimen and the real ball grid array (BGA) solder joint, respectively.…”

Section: Introductionmentioning

confidence: 99%

Effect of Bi Addition on Tensile Properties of Sn–Ag–Cu Solder at Low Temperature

et al. 2019

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In order to examine the effect of the Bi addition on tensile properties of SnAgCu solder at low temperatures, stress-strain diagrams were acquired by tensile tests at 233 K using miniature size specimens. Stress drops were observed in the stress-strain diagram of SnAgCuBi solder before it lead to a break. Similar phenomenon did not observed in the SnAgCu solder. The stress drops was exceptionally sharp in the SnAgCu solder with added 3 mass% Bi, compared to the solder with added 1 or 2 mass% Bi. The mode of the stress drop is depended on twin deformation. On the contrary, similar stress drop phenomenon was not observed in any stress-strain diagrams at 298 K. From the results of grain map analysis, it was found that many twin deformations occur in the specimen in which exceptional sharp stress drops appear in the stress-strain diagram.

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Section: Introductionmentioning

confidence: 99%