2010
DOI: 10.1016/j.intermet.2010.01.026
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Sn–Bi–Fe thermodynamic modeling and Sn–Bi/Fe interfacial reactions

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Cited by 25 publications
(23 citation statements)
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“…Since Fe is the major constituent of steels used in lead frames and solder pots [71,72], understanding the Sn-Bi/Fe interfacial reactions is important. As shown in Figure 2.28, the growth rates of the intermetallic compounds in the Sn-57 wt%Bi/Fe couples reacted at 390 C are higher than those at 500 C [33]. Further examination reveals that the different reaction rates are results of formation of different reaction phases at different temperatures.…”
Section: Unexpected Growth Rates (Sn-bi/fe and Sn-pb/fe)mentioning
confidence: 91%
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“…Since Fe is the major constituent of steels used in lead frames and solder pots [71,72], understanding the Sn-Bi/Fe interfacial reactions is important. As shown in Figure 2.28, the growth rates of the intermetallic compounds in the Sn-57 wt%Bi/Fe couples reacted at 390 C are higher than those at 500 C [33]. Further examination reveals that the different reaction rates are results of formation of different reaction phases at different temperatures.…”
Section: Unexpected Growth Rates (Sn-bi/fe and Sn-pb/fe)mentioning
confidence: 91%
“…Both experimental and thermodynamic modeling results are usually available for most of the binary solder-related phase diagrams; however, information regarding the ternary and higherordersystemsisrelativelylimited.Experimentalphaseequilibriummeasurementsareavailable for Sn-Ag-Au [19][20][21][22], Sn-Ag-Cu [23][24][25][26][27], Sn-Ag-Ni [28], Sn-Bi-Au [29], Sn-Bi-Ag [30,31], Sn-Bi-Cu [32], Sn-Bi-Fe [33], Sn-Bi-Ni [34], Sn-Cu-Au [35], Sn-Cu-Ni [36,37], Sn-In-Au [38], Sn-In-Cu [39], Sn-In-Ag [40], Sn-In-Ni [41], Sn-Sb-Ag [12,[42][43][44], Sn-Sb-Au [45], Sn-Zn-Ag [46], Sn-Zn-Bi [47], and Sn-Zn-Cu [48], and Sn-Ag-Cu-Ni [49,50] systems. As for lead-free soldering, there are some commercial thermodynamics databases, such as COST531 database [51], NIST solder database [52] and ADAMIS database [53].…”
Section: Phase Diagrams Of Pb-free Solder Systemsmentioning
confidence: 99%
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