Sn-Cu-Ni (SN100C) Lead-Free Solder Coating Wettability Study

Abstract

SN100C lead-free solder coating wettability on SN100C solder has been investigated on as soldered samples and exposed intermetallic compound (IMC). In addition, the effect of oxidation on its wettability has also been investigated. Oxidation layer on the coated copper surface was developed after 120 hours of exposure on as soldered samples and exposed IMC samples. GEN3 solderability test machine in globule mode was used to determine the wettability of each sample. The influence of oxidation and the effect of exposed IMC were established. Results show that oxidation affected wettability by increasing the wetting time. On the other hand, exposed IMC had increased the wetting time and decreased the maximum force.