2005
DOI: 10.1016/s1369-7021(05)70986-x
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Soft lithography contacts to organics

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Cited by 29 publications
(21 citation statements)
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“…The challenges are further exacerbated by the limited adhesion and contact at the interfaces between the layers that are relevant to organic electronics structures. [3][4][5] There is, therefore, a need to engineer new ways of improving charge mobility and adhesion/contact within/ between the layers that are relevant to organic solar cells and organic light emitting devices. There is also a potential for improving charge transport via incorporation of nanoscale titanium dioxide (TiO 2 ) particles into the active layers of organic solar cells and light emitting devices.…”
Section: Introductionmentioning
confidence: 99%
“…The challenges are further exacerbated by the limited adhesion and contact at the interfaces between the layers that are relevant to organic electronics structures. [3][4][5] There is, therefore, a need to engineer new ways of improving charge mobility and adhesion/contact within/ between the layers that are relevant to organic solar cells and organic light emitting devices. There is also a potential for improving charge transport via incorporation of nanoscale titanium dioxide (TiO 2 ) particles into the active layers of organic solar cells and light emitting devices.…”
Section: Introductionmentioning
confidence: 99%
“…Control over the electronic properties of semiconductors and metals is a central issue for their use in (opto)electronic devices. Modifying a solid's properties by changing its composition (e.g., via doping) is possible only within certain, generally narrow limits due to thermodynamic constraints. , Designing systems with interfaces, whose electrical properties can be varied, provides a significant degree of control over the system's electrical characteristics because electronic transport through devices depends critically on the properties of the interfaces through which electrons pass. …”
Section: Introductionmentioning
confidence: 99%
“…For instance, Au|monolayer|GaAs junctions were produced by nTP with a yield larger than 95% yield. 162,166,167 In contrast, Au|monolayer|Si junctions fabricated by nTP exhibited a yield as low as 20% accompanied by a poor electrical behaviour. 164 Figure 20 Schematic illustration of the nanotransfer printing (nTP) procedure.…”
Section: Figure 17 Schematic Illustration Of Physical Vapour Deposition (Pvd)mentioning
confidence: 99%