Proceedings of 2004 International IEEE Conference on the Asian Green Electronics (AGEC)
DOI: 10.1109/agec.2004.1290858
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Solder and adhesive free chip assembly using elastic chip sockets: concept, manufacture and preliminary investigations

Hjalmar Hesselbom
1
,
Gunnar Norberg
2
,
Slavko Dejanovic
3
et al.
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