Solder Flux Residues and Humidity-Related Failures in Electronics: Relative Effects of Weak Organic Acids Used in No-Clean Flux Systems

Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

doi:10.1007/s11664-014-3609-0

Cited by 91 publications

(48 citation statements)

References 22 publications

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“…III.A highlighted the effect of RH exposure conditions on the impedance due to the hygroscopicity of NaCl salt and atmospheric particles deposited on the SIR patterns. Electrical methods were used by many authors in order to observe the phase-transitions of inorganic salts [7], [17], [19], weak organic acid [8], coarse dust [18] or atmospheric particles [23] deposited on different surfaces. The authors highlighted the effectiveness of this method to characterize the DRH of the contaminants.…”

Section: Discussionmentioning

confidence: 99%

“…Verdingovas et al (2014) [7] investigated the effect of NaCl contamination at different RH and temperature on surface insulation resistance (SIR) and reported a pronounced reduction in SIR above 75% RH at room temperature. Lately, Verdingovas et al (2015) [8] pointed out the effects of five weak organic acids -namely adipic, succinic, DL-malic, glutaric and palmitic acids commonly used in no-clean fluxes -on the leakage current (LC), particularly on the RH thresholds above which LC increased abruptly. These studies highlighted the role of the deliquescence of the contaminants on the corrosion of metals.…”

Section: Introductionmentioning

confidence: 99%

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On the Effects of Atmospheric Particles Contamination and Humidity on Tin Corrosion

D'Angelo

Verdingovas

Ferrero

et al. 2017

IEEE Trans. Device Mater. Relib.

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Abstract-The effects of hygroscopic atmospheric particles are investigated in relation with corrosion of tin. Surface insulation resistance test boards were directly contaminated both with ambient particles sampled in the field at Milan (Italy) and with pure saline particles generated in the laboratory. An innovative particle deposition device was used to uniformly coat circular spots on to the test board surfaces. Deliquescence and crystallization of the water-soluble compounds were detected by observing the impedance response to varying relative humidity (RH) conditions with a gradual and continuous ramps. The effects of the adsorption/desorption kinetics and of the temperature on the deliquescence and crystallization relative humidity values were also investigated. Leakage current measurements at 5 V DC highlighted the ability of atmospheric particles to promote corrosion and electrochemical migration at RH levels far below condensing conditions (100% RH).

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Section: Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

On the Effects of Atmospheric Particles Contamination and Humidity on Tin Corrosion

D'Angelo

Verdingovas

Ferrero

et al. 2017

IEEE Trans. Device Mater. Relib.

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“…The different humidity induced failure phenomena [1,2] have even growing importance because of the high integration and miniaturization trends in the electronics. One of these failure phenomena is called electrochemical migration (ECM) [3,4].…”

Section: Introductionmentioning

confidence: 99%

Electrochemical migration of Ni and ENIG surface finish during Environmental test contaminated by NaCl

Medgyes

2017

J Mater Sci: Mater Electron

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The electrochemical migration (ECM) mechanism occurs at the presence of moisture in the case of operating circuits and results in shorts (dendrites) between adjacent conductor lines/traces. Dendrite growth occurs as a result of metal ions being dissolved into a solution from the anode and deposited at the cathode, thereby growing in tree-like formations. In this study the water condensation process and ECM behavior of Nickel (Ni), Electroless Nickel Immersion Gold (ENIG) and pure copper were investigated using Thermal Humidity and Bias (THB) test in NaCl environment. The THB results show that Cu has higher ECM resistance than Ni and ENIG surface finishes, which was an unexpected result. The main influencing factors of the water condensation (e.g.: surface roughness, thermal parameters) and the ECM processes (precipitates and dendrites) were investigated and discussed in details. Furthermore, a novel ECM model for Ni and NiAu surface finish was established using THB test in case NaCl contaminated samples.

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“…It was proven that the metals which primarily compose lead-free solder alloys (Sn, Ag, Cu) have considerable susceptibility for ECM failure [2]. Other components of solder paste such as flux activators could also change the ECM susceptibility [12]. Investigations of solder flux residues from no-clean flux systems containing weak organic acid (WOA) activators with higher deliquescence point have positive effect on the reliability of electronics under high humidity [12] compared to halide containing flux systems.…”

Section: Introductionmentioning

confidence: 99%

Electrochemical migration of lead-free solder alloys in Na<inf>2</inf>SO<inf>4</inf> environment

Medgyes

Adam

Tar

et al. 2017

2017 40th International Spring Seminar on Electronics Technology (ISSE)

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Solder Flux Residues and Humidity-Related Failures in Electronics: Relative Effects of Weak Organic Acids Used in No-Clean Flux Systems

Cited by 91 publications

References 22 publications

On the Effects of Atmospheric Particles Contamination and Humidity on Tin Corrosion

On the Effects of Atmospheric Particles Contamination and Humidity on Tin Corrosion

Electrochemical migration of Ni and ENIG surface finish during Environmental test contaminated by NaCl

Electrochemical migration of lead-free solder alloys in Na<inf>2</inf>SO<inf>4</inf> environment

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