Solder Immersion Process of Ceramic Column Grid Array Package Assembly for Space Applications

Patel, Sanket; Pandey, Deep Kumar; Patil, Shrikant; Patel, Hitesh M.; Bindal, Arun; Sharma, R. S.; Bhattacharya, Amartya Kumar

doi:10.1109/tcpmt.2019.2961424

Cited by 5 publications

(1 citation statement)

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“…The combination of the higher operating temperature requirements of lead-free soldering and the sensitive nature of area-array components makes defining a rework procedure for lead-free BGA components difficult 5 . In high-density product design, multiple BGA components are placed close to each other; hence, the adjacent rework component locations have a high risk of being exposed to thermal reflows during rework 6 . Several obstacles can only be overcome by introducing new or revised methods, such as tighter thermal profiles and extreme precision during PCBA rework procedures 7 .…”

Section: Introductionmentioning

confidence: 99%

Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint

Ismail

Bakar

Ehsan

et al. 2022

Sci Rep

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This study investigated the effectiveness of heat shield placement locations during the rework process to avoid thermal and mechanical damage to adjacent ball grid array components and their solder joints on double-sided printed circuit board assembly. Three types of heat shield placement locations were used: sample X, individual heat shield placement on adjacent components of the rework location; sample Y, a U-shaped, and sample Z, a square-shaped heat shield placed respectively at the heat source location. The dye and pull test results, infrared thermography, and temperature measurements were analysed to understand the relationship between the location of the heat shield and solder joint damage during rework. Heat shield placement at the heat source location on the reworked component can reduce the peak temperatures on the adjacent rework component locations by up to 8.18%. The peak temperatures of the centre and corner of the BGA component can be maintained below 195 °C and 210 °C, respectively to improve the adjacent rework component locations' solder joint quality by reducing solder joint damage by more than 50% solder cracks. This is useful for thermal management during rework involving high-density ball grid array component placements on double-sided printed circuit board assembly.

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Section: Introductionmentioning

confidence: 99%