2014
DOI: 10.1016/j.egypro.2014.08.010
|View full text |Cite
|
Sign up to set email alerts
|

Solder Joint Failure Modes in the Conventional Crystalline Si Module

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
15
0

Year Published

2015
2015
2022
2022

Publication Types

Select...
4
1

Relationship

0
5

Authors

Journals

citations
Cited by 40 publications
(15 citation statements)
references
References 3 publications
0
15
0
Order By: Relevance
“…18 This Ag leaching effect develops crack in the soldered interface due to thermal expansion resulting in connection break down. Juris Kalejs 17 raised concern regarding robustness and durability of junction boxes.…”
Section: General Faults In All Pv Modulesmentioning
confidence: 99%
See 2 more Smart Citations
“…18 This Ag leaching effect develops crack in the soldered interface due to thermal expansion resulting in connection break down. Juris Kalejs 17 raised concern regarding robustness and durability of junction boxes.…”
Section: General Faults In All Pv Modulesmentioning
confidence: 99%
“…This causes wiring failure which leads to internal arcing. Uichi Itoh et al 18 depicted the potential risks associated due to soldering failures in junction boxes. The observations depicted two different faults, ie silver (Ag) leaching and solder joint fatigue.…”
Section: General Faults In All Pv Modulesmentioning
confidence: 99%
See 1 more Smart Citation
“…Remarkably, the on‐site infrared image in Figure B exhibits localized hot spots caused by solder bond failure, in accord with our deconvolution analysis of increased series resistance. It is generally known that solder bond failure is caused by the differential thermal expansion between the solder joints and surrounding materials during repeated thermal cycling . Therefore, solder bonds fail (crack) in a stepwise fashion .…”
Section: Application To Field Datamentioning
confidence: 99%
“…It is generally known that solder bond failure is caused by the differential thermal expansion between the solder joints and surrounding materials during repeated thermal cycling. 38,39 Therefore, solder bonds fail (crack) in a stepwise fashion. 40 Indeed, we find the signature of this stepwise increase in the series resistance in the Suns-Vmp analysis; see Figure 11A.…”
Section: Validation 4: Onsite Inspectionmentioning
confidence: 99%