Solder joint reliability in flip chip package with surface treatment of ENIG under thermal shock test

Ha, Sang-Su; Ha, Sang-Ok; Yoon, Jeong‐Won; Kim, Jong‐Woong; Ko, Min-Kwan; Kim, Dae-Gon; Kim, Sungjin; Hong, Tae-Whan; Jung, Seung‐Boo

doi:10.1007/s12540-009-0655-x

Cited by 11 publications

(3 citation statements)

References 15 publications

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“…The investigation of microstructure evolutions and cracks occurrence was focused on the corner micro joint, as it experienced the highest thermally induced stress under thermal cycling conditions. Thereby, the cracks tend to preferentially take place in this micro-joint as previously reported (Ha et al, 2009). In Figure 2(c), one continuous IMC layer with small needleshape was observed to form at the Cu pad interface.…”

Section: Experimental Processsupporting

confidence: 81%

Intermetallics evolution and its reliability effects on micro-joints in flip chip assemblies

Tian

Fang

Ren

et al. 2020

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Purpose This paper aims to assess precise correlations between intermetallic compounds (IMCs) microstructure evolutions and the reliability of micro-joints with a Cu/SAC305solder/Ni structure using thermal shock (TS) tests. Design/methodology/approach This paper uses 200-µm pitch silicon flip chips with nickel (Ni) pads and stand-off height of approximately 60 µm, assembled on substrates with copper (Cu) pads. After assembly, the samples were subjected to air-to-air thermal shock testing from 55 to 125 per cent. The transfer time was less than 5 s, and the dwell time at each temperature extreme was 15 min. To investigate the microstructure evolution and crack growth, two samples were removed from the thermal shock chamber at 0, 400, 1,200, 2,000, 5,800 and 7,000 cycles. Findings The results showed that one (Cu, Ni)6Sn5/(Ni, Cu)3Sn4 dual-layer structure formed at the Ni pad interface of chip side dominates the micro-joints failure. This is because substantial (Ni, Cu)3Sn4 grain boundaries provide a preferential pathway for the catastrophic crack growth. Other IMCs microstructure evolutions that cause the prevalent joints failure as previously reported, i.e. thickened interfacial (Cu, Ni)6Sn5 and Ni3P layer, and coarsened IMCs inside the solder matrix, only contributed to the occurrence of fine cracks. Moreover, the typical interfacial IMCs spalling triggered by thermally induced stress did not take place in this study, showing a positive impact in the micro-joint reliability. Originality/value As sustained trends toward multi-functionality and miniaturization of microelectronic devices, the joints size is required to be constantly scaled down in advanced packages. This arises a fact that the reliability of small-size joints is more sensitive to the IMCs because of their high volume proportion and greatly complicated microstructure evolutions. This paper evaluated precise correlations between IMCs microstructure evolutions and the reliability of micro-joints with a Cu/SAC305solder/Ni structure using TS tests. It found that one (Cu, Ni)6Sn5/(Ni, Cu)3Sn4 dual-layer structure formed at the Ni pad interface dominate the micro-joints failure, whereas other IMCs microstructure evolutions that cause the prevalent joints failure exhibited nearly negligible effects.

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Section: Experimental Processsupporting

confidence: 81%

Intermetallics evolution and its reliability effects on micro-joints in flip chip assemblies

Tian

Fang

Ren

et al. 2020

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“…It provided important solder bump integrity and robustness information and the most useful and wide adopted measurement technique for solder bump quality and reliability assessments (Tan et al , 2017; Kim et al , 2009). With the miniaturization of solder joints, solder joints were more prone to failure under thermal shock and the impact reliability of solder joints has been paid more and more attention (Kim et al , 2006; Ha et al , 2009; Kim et al , 2007). But Pb-free solder joints may be paid too much attention and Sn-Pb solder joints may be ignored.…”

Section: Introductionmentioning

confidence: 99%

Property of Sn-37Pb solder bumps with different diameter during thermal shock

Gan

Yang

et al. 2021

SSMT

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Purpose The impact strength of solder joint under high strain rate was evaluated by board level test method. However, the impact shear test of single solder bump was more convenient and economical than the board level test method. With the miniaturization of solder joints, solder joints were more prone to failure under thermal shock and more attention has been paid to the impact reliability of solder joint. But Pb-free solder joints may be paid too much attention and Sn-Pb solder joints may be ignored. Design/methodology/approach In this study, thermal shock test between −55°C and 125°C was conducted on Sn-37Pb solder bumps in the BGA package to investigate microstructural evolution and growth mechanism of interfacial intermetallic compounds (IMCs) layer. The effects of thermal shock and ball diameter on the mechanical property and fracture behavior of Sn-37Pb solder bumps were discussed. Findings With the increase of ball size, the same change tendency of shear strength with thermal shock cycles. The shear strength of the solder bumps was the highest after reflow; with the increase of the number of thermal shocks, the shear strength of the solder bumps was decreased. But at the time of 2,000 cycles, the shear strength was increased to the initial strength. Minimum shear strength almost took place at 1,500 cycles in all solder bumps. The differences between maximum shear strength and minimum shear strength were 9.11 MPa and 16.83 MPa, 17.07 MPa and 15.59 MPa in φ0.3 mm and φ0.4 mm, φ0.5 mm and φ0.6 mm, respectively, differences were increased with increasing of ball size. With similar reflow profile, the thickness of IMC decreased as the diameter of the ball increased. The thickness of IMC was 2.42 µm and 2.17 µm, 1.63 µm and 1.77 µm with increasing of the ball size, respectively. Originality/value Pb-free solder was gradually used to replace traditional Sn-Pb solder and has been widely used in industry. Nevertheless, some products inevitably used a mixture of Sn-Pb and Pb-free solder to make the transition from Sn-Pb to Pb-free solder. Therefore, it was very important to understand the reliability of Sn-Pb solder joint and more further research works were also needed.

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“…Da Silva et al [9] described an analysis of the moisture ingress into polymeric surge arresters through measurements of the alternating current (AC) leakage rather than direct current (DC) leakage; this analysis could be performed based on the maximum continuous operating voltage (MCOV). Ha et al [10] conducted thermal shock tests to evaluate the reliability of solder joints, reducing the testing time by a factor of five and leading to a reduction in the qualification time and cost. Rajalakshmi et al [11] presented the results of a vibration test analysis on a 500-W polymer electrolyte membrane (PEM) fuel-cell stack developed at our center.…”

Section: Introductionmentioning

confidence: 99%

Optimized Environmental Test Sequences to Ensure the Sustainability and Reliability of Marine Weapons

Yang

Kim

2014

Sustainability

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Abstract:In recent years, there has been an increase in the types of marine weapons used in response to diverse hostile threats. However, because marine weapons are only tested under a single set of environmental conditions, failures due to different environmental stresses have been difficult to detect. Hence, this study proposes an environmental test sequence for multi-environment testing. The environmental test sequences for electrical units described in the international standard IEC 60068-1, and for military supply described in the United States national standard MIL-STD-810G were investigated to propose guidelines for the appropriate test sequences. This study demonstrated the need for tests in multiple environments by investigating marine weapon accidents, and evaluated which environmental stresses and test items have the largest impacts on marine weapons using a two-phase quality function deployment (QFD) analysis of operational scenarios, environmental stresses, and environmental test items. Integer programming was used to determine the most influential test items and the shortest environmental test time, allowing us to propose optimal test procedures. Based on our analysis, we developed optimal environmental test sequences that could be selected by a test designer.

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Solder joint reliability in flip chip package with surface treatment of ENIG under thermal shock test

Cited by 11 publications

References 15 publications

Intermetallics evolution and its reliability effects on micro-joints in flip chip assemblies

Intermetallics evolution and its reliability effects on micro-joints in flip chip assemblies

Property of Sn-37Pb solder bumps with different diameter during thermal shock

Optimized Environmental Test Sequences to Ensure the Sustainability and Reliability of Marine Weapons

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