Solder Short Reject Reduction in Soft Solder Die Attach (SSD) Process Using Mechanical Solder Shield Design

Abstract

This paper presents a development of mechanical solder shield, which was integrated to the Soft Solder Dispenser (SSD) die attach machine. The innovation of the mechanical shield has proven its ability to prevent the molten solder overflows to the lead area of the device. As a result, it reduced number of solder short defects. The manufacturing assembly yield is maintained at the highest level; ensuring fitness for function and production cost of the product remain competitive.