Solderability, Microstructure, and Thermal Characteristics of Sn-0.7Cu Alloy Processed by High-Energy Ball Milling

Sharma, Ashutosh; Oh, Min Chul; Chae, Myoung Jin; Seo, Hyungtak; Ahn, Byungmin

doi:10.3390/met10030370

Cited by 3 publications

(2 citation statements)

References 42 publications

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“…In practice, in terms of preparing LMPAs, the main methods used in industry, such as high-energy ball milling, mechanical crushing, and centrifugal atomization, have a major limitation in reducing the size of LMPAs. The commercially available LMPA solder ball is usually 20–50 μm, considerably larger than the typical optimal size of Ag flakes (2–10 μm) in the ECAs.…”

Section: Introductionmentioning

confidence: 99%

Size-Controlled Low-Melting-Point-Alloy Particle-Incorporated Transient Liquid-Phase Epoxy Composite Conductive Adhesive with High Performances

Yang

Liu

Zhang

et al. 2023

ACS Appl. Polym. Mater.

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With fast developments in the environmental-friendly industry, electrically conductive adhesive (ECA) composites with high electrical conductivity, mechanical strength, and electrochemical migration resistance as well as low cost are highly desirable for emerging power electronics applications. In this study, a category of ECAs, namely, size-controllable sonochemical low-melting-point-alloy (LMPA) particle-incorporated transient liquid-phase ECAs (TLP-ECAs), with excellent electrical conductivity, considerable mechanical strength, and high electrochemical migration resistance has been successfully demonstrated. Experimental results showed that the bulk resistivity of TLP-ECA decreased to a minimum value of 2.37 × 10–4 Ω-cm with the remaining filler content at a low level (the total content of metallic fillers, i.e., 70 wt % in TLP-ECAs), while the mechanical shear strength increased considerably (by 55.4%) compared with pure silver ECA with the same filler content, demonstrating that addition of sonochemical LMPA particles into ECA can simultaneously and considerably improve the electrical and mechanical properties. Moreover, the diffusional reaction mechanism of sonochemical LMPA particle-filled TLP-ECA was systematically investigated via differential scanning calorimetry (DSC), X-ray diffraction (XRD), and high-resolution scanning transmission electron microscopy in high-resolution high-angle annular dark-field mode (STEM-HAADF). The mechanism of the diffusion reaction of TLP-ECA with LMPA particles was rationalized, where Ag9In4 (γ phase, cP52, and P43m) and Ag3Sn (ε phase, oP8, and Pmmm) intermetallic compounds (IMC) and their corresponding nanostructures were responsible for the substantial enhancement in mechanical strength and the antielectrochemical migration property. The sonochemical method is the key to synthesize LMPA particles of desirable compositions and controllable size, thereby enhancing the overall performance of Ag-based TLP-ECAs. Accordingly, the sonochemical LMPA particle-incorporated-TLP-ECAs are the promising interconnection material candidates for power electronics packaging.

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Section: Introductionmentioning

confidence: 99%

Size-Controlled Low-Melting-Point-Alloy Particle-Incorporated Transient Liquid-Phase Epoxy Composite Conductive Adhesive with High Performances

Yang

Liu

Zhang

et al. 2023

ACS Appl. Polym. Mater.

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“…However, the resulting joints were easily oxidized at high temperatures, and the shear strength and hermeticity of joints reduced [9]. High vacuum and inert atmosphere limited the wide application of AMB [10][11][12][13][14][15][16][17], while it was worth noting that the joints brazed using RAB possessed excellent high-temperature oxidation resistance [18,19]. During the RAB process, the oxide compound may react with the surface of the ceramic, newly forming a surface wetting ceramic.…”

Section: Introductionmentioning

confidence: 99%

Study on Reactive Air Brazing of p-SiO2 Ceramic with Ag-xCuO Filler Metal

Chen,

Ma,

2023

Metals

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Reactive air brazing of porous SiO2 ceramic (p-SiO2) was achieved using Ag-CuO filler metal. When brazing p-SiO2, two main problems existed. Firstly, the wettability of the Ag filler metal on the surface of p-SiO2 was poor. Secondly, the residual stress caused by the mismatch of the coefficient of thermal expansion was high in the joint. In order to solve these problems, the effects of CuO contents on the p-SiO2 brazed joint were analyzed. In a wetting experiment, the addition of CuO significantly improved the wettability of the Ag-CuO/p-SiO2 system. With the content of CuO increasing, the contact angle decreased from 90° to 0°. In addition, when the content of CuO increased to 0.5 mol%, the contact angle decreased from 90° to 52°. Then, during brazing p-SiO2 with the Ag-xCuO filler metal, the typical interfacial microstructure of the joints brazed at 1000 °C for 30 min was p-SiO2 ceramic/Ag (s,s) + SiO2 + CuO/Ag (s,s)/Ag (s,s) + SiO2 + CuO/p-SiO2 ceramic. Meanwhile, Ag-CuO infiltrated into the p-SiO2 ceramic and an infiltration layer formed. The infiltration layer was composed of Ag (s,s) + SiO2 + CuO and the infiltration layer was conductive to form a good gradient transition of the coefficient of thermal expansion (CTE). Then, the residual stress in the joint was released and the shear strength improved. In addition, with the content of CuO increasing, the depth of the infiltration layer increased. Furthermore, when the content of CuO was 0.5 mol%, the maximum shear strength of the joint was 55 MPa.

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A review on nanodispersed lead-free solders in electronics: synthesis, microstructure and intermetallic growth characteristics

et al. 2022

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Solderability, Microstructure, and Thermal Characteristics of Sn-0.7Cu Alloy Processed by High-Energy Ball Milling

Cited by 3 publications

References 42 publications

Size-Controlled Low-Melting-Point-Alloy Particle-Incorporated Transient Liquid-Phase Epoxy Composite Conductive Adhesive with High Performances

Size-Controlled Low-Melting-Point-Alloy Particle-Incorporated Transient Liquid-Phase Epoxy Composite Conductive Adhesive with High Performances

Study on Reactive Air Brazing of p-SiO2 Ceramic with Ag-xCuO Filler Metal

A review on nanodispersed lead-free solders in electronics: synthesis, microstructure and intermetallic growth characteristics

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