2015
DOI: 10.1117/12.2178373
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Solderjet bumping technique used to manufacture a compact and robust green solid-state laser

Abstract: Solder-joining using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering processes are especially well suited for the joining of optical components made of fragile and brittle materials such as glasses, ceramics and optical crystals due to a localized and minimized input of thermal energy. The Solderjet Bumping technique is used to assemble a miniaturized laser resonator in order to obtain higher robustness, wider thermal conductivity performance, higher vacuum and radiation com… Show more

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Cited by 5 publications
(3 citation statements)
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“…The joined silica lens and titanium barrel has revealed outstanding performances in terms of WFE (<5 nm rms_i) and depolarization (<0.02%); and it has successfully withstood humidity test, thermal-vacuum cycles (from -40 to +60 °C) vibration (up to 33 grms), and shock (600 g) with a high centering stability below 1 µm. Solderjet bumping technology has demonstrated the ability to assemble high-precision and advanced optical systems made with different materials [8] being able also to withstand harsh environments required for space missions [9].…”
Section: Discussionmentioning
confidence: 99%
“…The joined silica lens and titanium barrel has revealed outstanding performances in terms of WFE (<5 nm rms_i) and depolarization (<0.02%); and it has successfully withstood humidity test, thermal-vacuum cycles (from -40 to +60 °C) vibration (up to 33 grms), and shock (600 g) with a high centering stability below 1 µm. Solderjet bumping technology has demonstrated the ability to assemble high-precision and advanced optical systems made with different materials [8] being able also to withstand harsh environments required for space missions [9].…”
Section: Discussionmentioning
confidence: 99%
“…We use an established PVD metallization system feasible for different substrate materials that consists of titanium, platinum, and gold. Using Solderjet Bumping we demonstrated sub-micron accuracy packaging of numerous micro-optical assemblies [18], the bonding of polarization maintaining fibers [19], the assembly of a compact and robust solid-state laser for the ExoMars mission [20], and the low stress mounting of lenses [21].…”
Section: Laser-based Solderjet Bumpingmentioning
confidence: 99%
“…16 The adapted LI device, here using soft-solder inorganic alloys, in contrast to commonly used organic adhesives. It promises higher robustness 17,18 and assures space-compatible devices 18 while avoiding damage to the optical components. 19,20 The LSP optical design was performed to obtain a device that can induce air breakdown at a distance comparable to the electrical discharge distance of an ESP used for ignition in a real automobile engine.…”
Section: Introductionmentioning
confidence: 99%