Solid/Solid State Interfacial Reactions in the Sn-9Zn/Cu-Based Alloys (C1990 HP, Alloy 25, and C194) Couples

Laksono, Andromeda Dwi; Al-Audhah, Lutfi Yunus Wahab; Chen, Chih‐Ming; Ho, Yu Xuan; Yen, Yee‐Wen

doi:10.1007/s11837-023-05827-1

Cited by 3 publications

(2 citation statements)

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“…However, the limited quantity of Ti present in C1990 HP did not induce any alteration in the phase. Additional discoveries indicate that the introduction of a small amount of Ti into Cu to create C1990 HP results in an amplified growth of the IMC and extensive spalling of the Cu 6 Sn 5 phase in the reaction couples of Sn/C1990 HP (Laksono et al , 2019, 2022a, 2022b), Sn-0.7 wt.% Cu/C1990 HP (Laksono et al , 2023) and Sn-3.0 wt.% Ag-0.5 wt.% Cu/C1990 HP (Yen et al , 2019a) during the liquid/solid reaction. The spalling phenomenon was observed to vary with changes in reaction time and temperature.…”

Section: Resultsmentioning

confidence: 99%

“…Besides that, it shows great potential for utilization as lead frames due to its low thermal expansion characteristic, which effectively safeguards circuits against degradation. Previous research on solid/solid diffusion bonding techniques between SnZn and C1990 HP couples has provided explanations regarding interfacial reactions, including the formation, morphologies and growth mechanisms of IMCs (Laksono et al , 2023). The incorporation of Ti into the SnZn/C1990 HP couple yielded successful preservation of the Cu-Zn IMC while preventing the formation of Cu-Sn IMC.…”

Section: Introductionmentioning

confidence: 99%

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Interfacial reactions in the Sn-9.0 wt.% Zn/Cu-Ti alloy (C1990 HP) couple

Laksono,

Chen,

Yen

2023

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Purpose The purpose of this study was to examine the influence of adding a small amount of Ti to a Cu-based alloy, specifically the commercial Hyper Titanium Copper alloy (C1990 HP), which contains Cu-3.28 wt.% Ti, on its interfacial reaction with Sn-9.0 wt.% Zn (SnZn) solder, using the liquid/solid reaction couple technique. Design/methodology/approach The SnZn/C1990 HP couples were subjected to a reaction temperature of 240–270°C for a duration of 0.5–5 h. The resulting reaction couple was characterized using a scanning electron microscope, energy dispersive spectrometer, electron probe microanalyzer and X-ray diffractometer. Findings It was observed that the scallop-shaped CuZn5 and planar Cu5Zn8 phases were formed in almost all SnZn/C1990 HP couples. With increased reaction duration and temperature, the Cu-rich intermetallic compound (IMC)-Cu5Zn8 phase became a dominant IMC formed at the interface. The total thickness of the IMCs was increased with the increase in the reaction duration and temperature. The IMC growth obeyed the parabolic law, and the IMC growth mechanism was diffusion controlled. The activation energy of the SnZn/C1990 HP couple was 64.71 kJ/mol. Originality/value This article presents an analysis of the IMC thickness in each sample using ImageJ software, followed by kinetic analysis using Origin software at various reaction temperatures of SnZn/C1990 HP in liquid/solid couples. The study also includes detailed reports on the morphology, interface composition and X-ray diffraction analysis, as well as the activation energy. The findings can serve as a valuable reference for electronic packaging companies that utilize C1990 HP substrates.

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