Solid solution softening and enhanced ductility in concentrated FCC silver solid solution alloys

Huo, Yongjun; Wu, Jiaqi; Lee, Chin C.

doi:10.1016/j.msea.2018.05.057

Cited by 19 publications

(2 citation statements)

References 55 publications

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“…In addition, the electronics industry is actively embracing environmentally friendly interconnect materials for green process manufacturing and green packaging, thus complying with the concept of "green production." Anisotropic conductive film (ACF) is a widely used electronic component, consisting of conductive particles and adhesive polymer resins [18][19][20][21]. By subjecting the ACF to specific temperature and pressure conditions [22], the conductive particles within the ACF are compressed vertically (in the Z-axis direction), facilitating an electrical conduction pathway [23].…”

Section: Introductionmentioning

confidence: 99%

Size Effects of Au/Ni-Coated Polymer Particles on the Electrical Performance of Anisotropic Conductive Adhesive Films under Flexible Mechanical Conditions

Fang,

Wang,

et al. 2024

Materials

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In soft electronics, anisotropic conductive adhesive films (ACFs) are the trending interconnecting approach due to their substantial softness and superior bondability to flexible substrates. However, low bonding pressure (≤1 MPa) and fine-pitch interconnections of ACFs become challenging while being extended in advanced device developments such as wafer-level packaging and three-dimensional multi-layer integrated circuit board assembly. To overcome these difficulties, we studied two types of ACFs with distinct conductive filler sizes (ACF-1: ~20 μm and ACF-2: ~5 μm). We demonstrated a low-pressure thermo-compression bonding technique and investigated the size effect of conductive particles on ACF’s mechanical properties in a customized testing device, which consists of flexible printing circuits and Flex on Flex assemblies. A consistency of low interconnection resistance (<1 Ω) after mechanical stress (cycling bending test up to 600 cycles) verifies the assembly’s outstanding electrical reliability and mechanical stability and thus validates the great effectiveness of the ACF bonding technique. Additionally, in numerical studies using the finite element method, we developed a generic model to disclose the size effect of Au/Ni-coated polymer fillers in ACF on device reliability under mechanical stress. For the first time, we confirmed that ACFs with smaller filler particles are more prone to coating fracture, leading to deteriorated electrical interconnections, and are more likely to peel off from substrate electrode pads resulting in electrical faults. This study provides guides for ACF design and manufacturing and would facilitate the advancement of soft wearable electronic devices.

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Section: Introductionmentioning

confidence: 99%

Size Effects of Au/Ni-Coated Polymer Particles on the Electrical Performance of Anisotropic Conductive Adhesive Films under Flexible Mechanical Conditions

Fang,

Wang,

et al. 2024

Materials

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“…Surface asperities can be overcome by utilizing a thermo-plastically deformation mechanism, whereby increasing the percentage of the atomic-level direct contact area. In essence, it is important to design and modulate the properties of solid-state bonding materials [ 8 ], such as yield strength, microstructure, orientations, and surface state, in order to further reduce bonding temperature/pressure. To date, it is highly desirable to develop a suitable metal-based solid-state direct bonding method with low bonding temperature/pressure for microelectronic packaging industry [ 9 ].…”

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confidence: 99%