1988
DOI: 10.1007/bf01154583
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Solid-state transformations during diffusion bonding of copper to iron

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Cited by 23 publications
(10 citation statements)
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“…This method has already proved considerable potential for joining of Ti and Al base alloys [3][4][5][6][7]. Joining of varieties of dissimilar and similar materials has already been carried out by diffusion bonding, though many of the parameters of the thermomechanical processing are yet to be established on commercial scale [8][9][10][11][12][13]. The joints between Ti and stainless steel find wide applications in nuclear industry.…”
Section: Introductionmentioning
confidence: 99%
“…This method has already proved considerable potential for joining of Ti and Al base alloys [3][4][5][6][7]. Joining of varieties of dissimilar and similar materials has already been carried out by diffusion bonding, though many of the parameters of the thermomechanical processing are yet to be established on commercial scale [8][9][10][11][12][13]. The joints between Ti and stainless steel find wide applications in nuclear industry.…”
Section: Introductionmentioning
confidence: 99%
“…On the other hand, the adherence of the aluminum and alumina bonds enhanced with increasing bonding temperature. Calvo et al (1988) showed that the solid-state diffusion happened between iron and copper at elevated temperatures along with bonding pressure, which produced microstructural change in bond interface. A closer interlayer eutectoid substance was formed to the base iron, when bonding between iron and copper took place at a temperature higher than 900°C.…”
Section: Solid-state Bondingmentioning
confidence: 98%
“…19,22 The influence of the bonding atmosphere was also studied (P O2 from 10 21 Pa to 10 23 Pa). Recovery of the parent alloy properties that were lost during the bonding thermal cycle is the last stage of the bonding procedure.…”
Section: B Diffusion Bonding Trials and Postbonding Treatmentmentioning
confidence: 99%