Solidification on a substrate

Dynamic wetting and heat transfer at the initiation of aluminum solidification on copper substrates

“…Tests with copper, zirconium and aluminum droplets were carried out, allowing dynamic wetting to be classified and showing the viability of this approach to find valid melt/substrate combinations for rapid solidification processes. Maringer [4] also used drop-splat experiments to study rapid solidification and reported "critical temperatures'' for which falling droplets (tin, aluminum and zinc) would stick to an inclined substrate (copper, aluminum and steel).…”

“…In the aforementioned studies, three methods were employed to evaluate dynamic wetting: 1) apparent contact angles [5-8, 10, 13], 2) adherence forces [3,4] and 3) spreading factors [9,10,12]. A vast amount of work with the sessile drop method has also been published; see for example the compilation by Eustathopoulos et al [16].…”

Sticking behavior and transformation of tin droplets on silicon wafers and multilayer-coated mirrors

“…Thin surface oxide layers can also influence the adhesion behavior of metal droplets considerably [3]. During freezing after impact release stresses and effects of surface tension may built up, and flattened splats may detach from the substrate [2]. Very recently, for liquid tin droplets impinging at fairly low velocity, de Ruiter et al reported so-called self-peeling when examining smooth, flat, horizontally oriented surfaces of various materials with different thermal conductivity and effusivity [9].…”

“…Dependent on droplet impact conditions and substrate properties, drops can spread and freeze with or without adhesion, they can also splash or even bounce [1]. The behavior of molten metal droplets impacting and solidifying on substrates [2] is of industrial interest, for example, for thermal spray coating [3] and for the rapid printing of electrically conductive structures [4]. The process of solidification and adhesion of molten tin droplets impinging on stainless steel plates was studied in detail both experimentally and with numerical modeling for different velocities and surface conditions by Chandra and coworkers [5][6][7][8].…”

“…The process of solidification and adhesion of molten tin droplets impinging on stainless steel plates was studied in detail both experimentally and with numerical modeling for different velocities and surface conditions by Chandra and coworkers [5][6][7][8]. The sticking of tin splats is strongly influenced by heat transfer [2] and depends critically on the droplet velocity and temperature as well as the thermal properties, composition and surface roughness of the substrate. Thin surface oxide layers can also influence the adhesion behavior of metal droplets considerably [3].…”