Solids in static contact

Jones, M. H.; Howells, R I L; Probert, S.D.

doi:10.1016/0043-1648(68)90284-6

Cited by 22 publications

(8 citation statements)

References 27 publications

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“…All thermal dissipation solutions in which a solid heatproducing device is placed in contact with a solid heat sink suffer from physical junction thermal interface resistance. Between any two solid, non-compliant materials, the total percentage of surface area making contact can be quite low, with a strong dependence on factors such as microscopic scale surface roughness, material plasticity, and mounting pressure [18][19][20]. A low proportion of direct surface contact at a physical junction inevitably means that gaps are filled with air, which has very poor heat transfer characteristics relative to the metals on each side of the junction.…”

Section: Introductionmentioning

confidence: 99%

Thermal interface materials with graphene fillers: review of the state of the art and outlook for future applications

et al. 2021

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We review the current state-of-the-art graphene-enhanced thermal interface materials for the management of heat in the next generation of electronics. Increased integration densities, speed and power of electronic and optoelectronic devices require thermal interface materials with substantially higher thermal conductivity, improved reliability, and lower cost. Graphene has emerged as a promising filler material that can meet the demands of future high-speed and high-powered electronics. This review describes the use of graphene as a filler in curing and non-curing polymer matrices. Special attention is given to strategies for achieving the thermal percolation threshold with its corresponding characteristic increase in the overall thermal conductivity. Many applications require high thermal conductivity of composites, while simultaneously preserving electrical insulation. A hybrid filler approach, using graphene and boron nitride, is presented as a possible technology providing for the independent control of electrical and thermal conduction. The reliability and lifespan performance of thermal interface materials is an important consideration towards the determination of appropriate practical applications. The present review addresses these issues in detail, demonstrating the promise of graphene-enhanced thermal interface materials compared to alternative technologies.

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Section: Introductionmentioning

confidence: 99%

Thermal interface materials with graphene fillers: review of the state of the art and outlook for future applications

et al. 2021

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“…All thermal dissipation solutions in which a solid heat-producing device is placed in contact with a solid heat sink suffer from a physical junction thermal interface resistance. Between any two solid, non-compliant materials the total percentage of surface area making contact can be quite low, with a strong dependence on factors such as microscopic scale surface roughness, material plasticity, and mounting pressure [18][19][20]. A low proportion of direct surface contact at a physical junction inevitably means that gaps are filled with air, which has very poor heat transfer characteristics relative to the metals on each side of the junction.…”

Section: Introductionmentioning

confidence: 99%

Review of Graphene-based Thermal Polymer Nanocomposites: Current State of the Art and Future Prospects

Lewis¹,

Perrier²,

Barani³

et al. 2020

Preprint

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We review the current state-of-the-art of graphene-enhanced thermal interface materials for the management of heat the next generation of electronics. Increased integration densities, speed, and power of electronic and optoelectronic devices require thermal interface materials with substantially higher thermal conductivity, improved reliability, and lower cost. Graphene has emerged as a promising filler material that can meet the demands of future high-speed and highpowered electronics. This review describes the use of graphene as a filler in curing and non-curing polymer matrices. Special attention is given to strategies for achieving the thermal percolation threshold with its corresponding characteristic increase in the overall thermal conductivity. Many applications require high thermal conductivity of the composites while simultaneously preserving electrical insulation. A hybrid filler graphene and boron nitride approach is presented as possible technology for independent control of electrical and thermal conduction. Reliability and lifespan performance of thermal interface materials is an important consideration towards the determination of appropriate practical applications. The present review addresses these issues in detail, demonstrating the promise of the graphene-enhanced thermal interface materials as compared to alternative technologies.

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“…Jones et al [7] review a number of experimental methods for determining the real contact area and discuss the use of both thermal and electrical contact resistance measurements. They state that the mechanism for electrical resistance is essentially the constriction resistance to election flow at the contact spot.…”

Section: Introductionmentioning

confidence: 99%

Characterization of Thermal Contact Resistance in Metal Micro-Textured Thermal Interface Materials Using Electrical Contact Resistance Measurements

Kempers¹,

Robinson²,

Lyons

2010

DDF

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A novel Metal Micro-Textured Thermal Interface Material (MMT-TIM) has been developed to address a number of shortcomings in conventional TIMs. This material consists of a thin metal foil with raised micro-scale features that plastically deform under an applied pressure thereby creating a continuous, thermally conductive, path between the mating surfaces. One of the difficulties in experimentally characterizing MMT-TIMs however, is distinguishing the bulk thermal resistance of the MMT-TIM from the thermal contact resistance that exists where it contacts the test apparatus. Since these materials are highly electrically conductive, this study attempts to employ electrical contact resistance measurements to estimate their thermal contact resistance. Tests using flat silver and gold specimens of known bulk thermal conductivity were used to develop a correlation between electrical and thermal contact resistance. This relationship was then employed to estimate the thermal contact resistance of a prototype silver MMT-TIM and indicates the thermal contact resistance accounts for approximately 10% of the measured thermal contact resistance. A number of issues related to this technique are discussed as well as its future outlook.

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Solids in static contact

Cited by 22 publications

References 27 publications

Thermal interface materials with graphene fillers: review of the state of the art and outlook for future applications

Thermal interface materials with graphene fillers: review of the state of the art and outlook for future applications

Review of Graphene-based Thermal Polymer Nanocomposites: Current State of the Art and Future Prospects

Characterization of Thermal Contact Resistance in Metal Micro-Textured Thermal Interface Materials Using Electrical Contact Resistance Measurements

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