2019
DOI: 10.1021/acsaelm.9b00325
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Solution-Processed HfOx for Half-Volt Operation of InGaZnO Thin-Film Transistors

Abstract: Solution-processed high-κ gate dielectrics, such as Al 2 O 3 and HfO 2 , show great potential for use in low-cost electronics. However, high-temperature treatments are generally needed to cure the film, limiting the use in flexible electronics. Here we use anodization, a simple, low-cost, solution-based method, to form thin, conformal, high quality HfO x layers at room temperature. Several anodization voltages were studied, and the relative quantity of Hf−O bonding was found to increase by 10% when increasing … Show more

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Cited by 22 publications
(16 citation statements)
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“…Eventually, a clear correlation is found between mobility and D it compared with the reported literature data based on sputter-coated a-IGZO thin films for which D it is at least 1 order of magnitude less than the values obtained in this work. 20 Therefore, our perception here is that the higher D it along with the very long channel width (18 mm) in this work actually results in quite low mobility values, which can be enhanced further by optimizing the interface between a solution-processed nanometer-thick dielectric and a-IGZO thin film and reducing the channel width. Drain current degradation under positive gate bias stress (PBS) has also been studied to demonstrate the performance stability.…”
Section: Resultsmentioning
confidence: 80%
See 1 more Smart Citation
“…Eventually, a clear correlation is found between mobility and D it compared with the reported literature data based on sputter-coated a-IGZO thin films for which D it is at least 1 order of magnitude less than the values obtained in this work. 20 Therefore, our perception here is that the higher D it along with the very long channel width (18 mm) in this work actually results in quite low mobility values, which can be enhanced further by optimizing the interface between a solution-processed nanometer-thick dielectric and a-IGZO thin film and reducing the channel width. Drain current degradation under positive gate bias stress (PBS) has also been studied to demonstrate the performance stability.…”
Section: Resultsmentioning
confidence: 80%
“…However, the anodization process is a very efficient and cost-effective technique to form insulating metal oxides with precise control over the film thickness down to the nanometer level. 20 Anodization is an electrochemical process that needs a pair of electrodes, an anode and a cathode, dipped inside a suitable electrolyte solution. Typically, the metal that needs to be anodized is used as the anode and a constant bias is applied to it for anodization.…”
Section: Introductionmentioning
confidence: 99%
“…[ 13 ] The low SS of (140.9 ± 8.6) mV dec −1 is due to the high dielectric constant of the dielectric layer and the good quality of the dielectric–semiconductor interface. [ 27 ] Ultralow voltage conditions are highly desirable in some applications, such as wearable or electrochemical devices to avoid parasitic electrochemical reactions, and promote safe and low power operation. [ 28 ] Due to the ultrathin dielectric layer, our a‐IGZO TFT active‐matrix could work at a low voltage of 1.8 V. The electrical performance of the a‐IGZO TFTs and active‐matrix up to 1.8 V gate bias is shown in Figures S6–S8 in the Supporting Information.…”
Section: Resultsmentioning
confidence: 99%
“…These properties make graphene have a very wide range of applications in flexible electronics, protective coatings, solar cells, etc. [ 15 , 16 , 17 , 18 , 19 , 20 , 21 ]. However, graphene is a hydrophobic material and it has no noticeable solubility in molecular solvents, which greatly limits its application.…”
Section: Introductionmentioning
confidence: 99%