Thin epitaxial
normalGaAs
films have been grown on (100) semi‐insulating
normalGaAs
(SI
normalGaAs
) by close‐spaced vapor transport (CSVT). The epitaxy has been confirmed by x‐ray diffraction spectra and SEM observation of etch pit shapes and orientations. The effect of hydrogen flux, water vapor pressure, distance between the source and the substrate, and transport temperature on the film growth has been measured and analyzed. A model based on the variation of the equilibrium constants of the reactions occurring at the surface of the source and the substrate has been developed to elucidate the growth of
normalGaAs
. The measurements of transport properties, performed on the CSVT depositions, show that the deposited
normalGaAs
films are always n‐type independently of the used source (n‐type, p‐type, or SI
normalGaAs
). The unintentionally introduced dopant concentration may vary from
5×1016 normalto 2×1018 cm−3
. It is shown that shallow traps associated to EL2 deep levels can be responsible for part of this doping, on the lowest charge carrier density side, but not above
∼5×1017 cm−3
. An unwanted dopant is always introduced by the present technique. It is proposed that Si could be the unwanted doping agent.