Aluminium induced electroless tin film deposition were carried on Cu and mild steel at 25˚C in presence of ultrasound irradiation. Ten times faster growth rate (5.04 µm/h) was observed when ultrasound was introduced with respect to processes without agitation (0.51 µm/h). These deposits are dense, homogeneous, pore free containing fine particles (25 nm in crystallite size) irrespective of the substrate, the sonication power applied and system with or without NaH2PO2. A better corrosion resistance (5 times higher compared to silent process) was materialized for the ultrasound application which might be due to thick deposits with fine particles.