tailored anisotropic optical, or magnetic responses; [11][12][13][14][15][16] ii) Metal and/or semiconductor material patterns on the 3D dielectric substrate can also be used for building 3D electric circuits ( Figure 1 ) including sensors, transistors, and memory devices; [17][18][19] and iii) free-standing hollow structures can be used as 3D containers (or encapsulation) for targeted drug delivery or used as scaffolds for artifi cial tissues. [20][21][22][23] In order to fully serve these functions, micro-and nanoscale surface patterning on the 3D dielectric structures plays a crucial role and, therefore, must be realized.Conventional 3D fabrications are typically built using layer-by-layer lithographic patterning methods, [ 20,24 ] 3D printing, [ 25,26 ] and/or self-aligned membrane projection lithography. [ 12,27 ] With these traditional methods, development of a 3D, hollow, polyhedral structure has been possible. In addition, limited surface patterning in microscale has been achieved. [ 28,29 ] However, since the conventional lithographic process is a top-down strategy, surface patterning on a free-standing enclosed hollow structure (i.e., 3D microcontainer) has not been realized. In this paper, we report on the realization of a 3D, free-standing, polyhedral, hollow structure with desired surface patterning on a dielectric material, i.e., aluminum oxide (Al 2 O 3 , 150 nm thick), in microscale to be used as a functionalized device (Figure 1 c). The 3D structure was realized with the combination of topdown (lithographic, Figure 1 a) and bottom-up (origami-inspired self-assembly, Figure 1 b) processes. The origami-inspired selfassembly approach combined with a top-down process is one of the few dependable approaches to realize 3D micro/nanoscale polyhedral structures with surface patterning. [ 4,10,[30][31][32] In this approach, 2D, lithographically patterned, planar features are connected with hinges at the joints which fold up the structure when they are heated to their melting temperature (Figure 1 ). This process not only offers easy control of size and shape, allowing for fabrication of free-standing, hollow systems, but also supports surface patterning with metal/semiconductor materials on each face of the 3D structure and large-scale production with a high yield. As a result, the technique allows heterogeneous integrations with various materials which can produce free-standing, 3D, multifunctional devices (Figure 1 c). In turn, diverse applications in electronic circuits, as well as optical and biomedical modules, can be achieved. In a previous study, a 3D structure has been made with desired surface patterning on dielectric materials using this self-assembly process. [ 10 ] However, the 3D structure was in nanoscale and showed low Multifunctional 3D microstructures have been extensively investigated for the development of new classes of electronic and optical devices. Here, functionalized, free-standing, hollow, 3D, dielectric (150 nm thick aluminum oxide) microcontainers with metal patterning on their...