2022
DOI: 10.3390/nano12121980
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Special Issue: Silicon Nanodevices

Abstract: In recent years, nanodevices have attracted a large amount of attention due to their low power consumption and fast operation in electronics and photonics, as well as their high sensitivity in sensor applications [...]

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Cited by 5 publications
(4 citation statements)
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“…Scherrer's equation is extensively used in materials science as it offers a facile way to calculate the size of crystallites within a sample. The analysis is based on the broadening of X-ray diffraction peaks occurred upon the changes in the crystallite's lateral dimensions [40]. Hence, the average crystallite size (D) of all sintered BT-xGTNPs samples was estimated using Scherrer's equation expressed in Eq.…”
Section: Hip-sinteredbt-xgtnpssamplesmentioning
confidence: 99%
“…Scherrer's equation is extensively used in materials science as it offers a facile way to calculate the size of crystallites within a sample. The analysis is based on the broadening of X-ray diffraction peaks occurred upon the changes in the crystallite's lateral dimensions [40]. Hence, the average crystallite size (D) of all sintered BT-xGTNPs samples was estimated using Scherrer's equation expressed in Eq.…”
Section: Hip-sinteredbt-xgtnpssamplesmentioning
confidence: 99%
“…However, the large lattice mismatch between Si and Ge(GeSn) is the main hurdle for the high-performance Ge(GeSn) APDs. To balance the multiplication effect and lattice mismatch problem, the SiGe layer is also an important candidate for the multiplication region due to its CMOS process compatibility, relatively strong avalanche effect, and smaller lattice mismatch with Ge and GeSn [ 160 , 161 , 162 , 163 ]. Moreover, SiGeC is a conspicuous choice for the multiplication region, which is helpful for the temperature coefficient of resistance and low noise level [ 164 , 165 ].…”
Section: Swir Apds Focal Plane Arrays (Fpas)mentioning
confidence: 99%
“…compatibility. Compared to the high-vacuum MBE reaction with a clean dangling bond surface, the CVD reaction process is more complex, and the material surface is generally rich in reaction byproducts and precursor molecules. ,, For the SiGe/Si MLs structure, in the process of growing SiGe on the Si layer, the Si–SiGe interface tends to be abrupt. However, during Si deposition on SiGe layers, the dangling bond energy causes that deposited Si to diffuse into the subsurface layers, forming a broad interface. ,, In previous studies, the introduction of surfactants to passivate the dangling bonds on Si/Ge surfaces can effectively improve the interface characterization.…”
Section: Introductionmentioning
confidence: 99%