Specimen alignment in an axial tensile test of thin films using direct imaging and its influence on the mechanical properties of BeCu

Kang, Dong-Joong; Park, Jun-Hyub; Shin, Myung-Soo; Ha, Jong-Eun; Lee, Hak‐Joo

doi:10.1088/0960-1317/20/8/085001

Cited by 13 publications

(17 citation statements)

References 27 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Alternatives are electro-static clamping [53] and mechanical locking via pin-in-hole [54] or geometries that conform to the gauge-end [55]. However, in all cases careful provisions for specimen alignment are necessary [56][57][58][59][60][61][62]. Transverse and rotational misalignment may occur between the specimen's longitudinal axis and the setup's loading axis.…”

Section: Design Principlementioning

confidence: 99%

“…However, reported results typically do not state what precision of alignment is needed and actually attained, with some notable exceptions. In [62] image processing has been employed to measure the rotational misalignment. Adequate alignment can also be established through repeated elastic loading and alignment adjustment until a maximum of the measured modulus is obtained [59].…”

Section: Design Principlementioning

confidence: 99%

“…Line-direction measurement can be used, e.g. through Canny-edge detection filtering of 2D images [62], though it requires two perpendicular imaging systems to determine inand out-of-plane misalignment. Therefore, here, optical profilometry is employed, which is well suited for measuring the 3D configuration of the chip and the gripper in a limited field of view.…”

Section: Misalignment Controlmentioning

confidence: 99%

See 2 more Smart Citations

On-wafer time-dependent high reproducibility nano-force tensile testing

Bergers¹,

Hoefnagels²,

Geers³

2014

J. Phys. D: Appl. Phys.

View full text Add to dashboard Cite

Time-dependent mechanical investigations of on-wafer specimens are of interest for improving the reliability of thin metal film microdevices. This paper presents a novel methodology, addressing key challenges in creep and anelasticity investigations through on-wafer tensile tests, achieving highly reproducible force and specimen deformation measurements and loading states. The methodology consists of a novel approach for precise loading using a pinin-hole gripper and a high-precision specimen alignment system based on three-dimensional image tracking and optical profilometry resulting in angular alignment of <0.1 mrad and near-perfect co-linearity. A compact test system enables in situ tensile tests of on-wafer specimens under light and electron microscopy. Precision force measurement over a range of 0.07 µN to 250 mN is realized based on a simple drift-compensated elastically-hinged load cell with high-precision deflection measurement. The specimen deformation measurement, compensated for drift through image tracking, yields displacement reproducibility of <6 nm. Proof of principle tensile experiments are performed on 5 µm-thick aluminum-alloy thin film specimens, demonstrating reproducible Young's modulus measurement of 72.6 ± 3.7 GPa. Room temperature creep experiments show excellent stability of the force measurement and underline the methodology's high reproducibility and suitability for time-dependent nanoforce tensile testing of on-wafer specimens.

show abstract

Section: Design Principlementioning

confidence: 99%

Section: Design Principlementioning

confidence: 99%

Section: Misalignment Controlmentioning

confidence: 99%

See 1 more Smart Citation

On-wafer time-dependent high reproducibility nano-force tensile testing

Bergers¹,

Hoefnagels²,

Geers³

2014

J. Phys. D: Appl. Phys.

View full text Add to dashboard Cite

show abstract

“…In the tensile test, it has been shown that bending stresses that inadvertently occur due to misalignment between the applied force and the specimen axes during testing can affect the test results. Therefore, the authors developed a novel and reliable image recognition system to evaluate the misalignment between the load-train and the specimen axes during the tensile test of the thin films by using a digital image processing technology with a CCD [13] developed image recognition system was adopted to secure a good alignment between the applied force and the specimen axes. Before mounting the specimen on jigs, the misalignment between the jig of the loadcell side and the jig of the actuator side was inspected using the system, Fig.…”

Section: Micro Tensile Testsmentioning

confidence: 99%

Tensile test of lead zirconate titanate (PZT)/Platinum (Pt) thin film

Park¹,

H.Y.Bae

et al. 2011

Materialwissenschaft Werkst

View full text Add to dashboard Cite

This paper presents the results of tensile tests for lead zirconate titanate (PZT)/Platinum (Pt) thin films of 2.15 lm thickness in atmospheric air at room temperature. An axial loading tester developed by the authors was used for the tests. The tester was equipped with a load cell with a maximum capacity of 0.5 N and a non-contact position measuring system based on the principle of capacitance micrometry. Furthermore, the tester was equipped with a CCD (chargecoupled device) system for measuring the displacement of the gage length. Specimens with three different widths (50, 100 and 150 lm) were fabricated to study the size (width of specimen) effects. The elastic moduli of the specimens with 50, 100 and 150 lm width were 72.8 € 3.7, 75.0 € 1.3, 73.3 € 1.8 GPa, respectively. In addition, the ultimate tensile strength of the specimens with 50, 100 and 150 lm width were 263.4 € 21.1, 238.6 € 4.5, 221.1 € 13.9 MPa, respectively. It was observed that the width of specimen has little effect on the elastic modulus of PZT/Pt thin films but has an effect on the ultimate tensile strength of PZT/Pt thin films and the ultimate tensile strength decreases as the width increases. It was assumed that the scatter in the ultimate tensile strength of 50 lm width was attributed to delamination of PZT/Pt layers before the fracture in the tensile test. The 0.2% offset yield strength could not be measured because the PZT/Pt thin film is very brittle.Keywords: Lead zirconate titanate thin film (PZT) / platinum (Pt) / micro tensile test / tensile strength / elastic modulus / thin film / Schlüsselwörter: dünne Blei-Zirkonat-Titanat (PZT) Schicht / Platin (Pt) / Mikrozugversuch / Zugfestigkeit / elastischer Modul / dünne Schicht /

show abstract

“…As mechanics researchers, we focus on the characterization of their mechanical properties, which are important factors affecting not only their performance but also the basis to analyze their reliabilities. Estimation of fundamental mechanical property requires that displacements and strains be measured at micron and submicron length scale [1][2][3][4][5], which means traditional macroscopic experimental testing methods like moiré method and digital image correlation (DIC) method are no longer applicable and it is urgent to develop novel microscopic testing methods.…”

Section: Introductionmentioning

confidence: 99%

Fabrication Technique of Deformation Carriers (Gratings and Speckle Patterns) with FIB for Microscale/Nanoscale Deformation Measurement

Xie

Wang

et al. 2013

Lecture Notes in Nanoscale Science and Technology

View full text Add to dashboard Cite

The fabrication technique of deformation carriers with focused ion beam (FIB) milling for microscale/nanoscale deformation measurement has been studied in this chapter. The deformation carriers refer to microscale/nanoscale gratings and speckle patterns, which are indispensable elements for moiré and digital image correlation (DIC) method under scanning electron microscope (SEM) respectively. The fabrication principle, the design, and the influencing factors of these two kinds of deformation carriers are studied respectively. Their successful applications to microscale/ nanoscale deformation measurement are also presented, which demonstrate that the deformation carriers combined with photo-mechanics techniques under SEM are effective tools for microscale/nanoscale deformation measurement.

show abstract

Specimen alignment in an axial tensile test of thin films using direct imaging and its influence on the mechanical properties of BeCu

Cited by 13 publications

References 27 publications

On-wafer time-dependent high reproducibility nano-force tensile testing

On-wafer time-dependent high reproducibility nano-force tensile testing

Tensile test of lead zirconate titanate (PZT)/Platinum (Pt) thin film

Fabrication Technique of Deformation Carriers (Gratings and Speckle Patterns) with FIB for Microscale/Nanoscale Deformation Measurement

Contact Info

Product

Resources

About