Specimen size effect on tensile strength of surface-micromachined polycrystalline silicon thin films

Tsuchiya, Toshiyuki; Tabata, Osamu; Sakata, Jiro; Taga, Yasunori

doi:10.1109/84.661392

Cited by 356 publications

(167 citation statements)

References 9 publications

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“…A smaller specimen shows a higher fracture stress/strain. (9,10) This is due to the decrease in the probability of a fracture source existing in a highly stressed region on a specimen. This is why fracture stress measured by a tensile test is usually lower than that measured by a bending test.…”

Section: Discussionmentioning

confidence: 99%

Irreversible Deformation of Micron-Thick Single-Crystal Silicon in the Temperature Range of 350–500 °C

2016

Sensors and Materials

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A 2-μm-thick single-crystal silicon (SCS) beam showed plastic deformation in the temperature range of 350-500 °C. SCS beams made from a top layer of a silicon-on-insulator (SOI) wafer were first elastically buckled by a compressive force applied from the free end in the longitudinal direction. While maintaining the buckled state, the beams were heated to an elevated temperature for 1 h in air. After cooling and releasing the applied force, the residual bent profile was measured using a laser profiler. A plastic hinge was observed to appear for the beams bent in the temperature range of 350-500 °C but not at 300 °C. Plasticity appeared under a large elastic strain in the range of 2-5% at the elevated environmental temperatures. Slip lines of the crystal were clearly observed at the plastically bent beam surfaces. We further demonstrated that a permanent out-of-plane deformation was obtained by applying hot air flow to a SCS film structure.

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Section: Discussionmentioning

confidence: 99%

Irreversible Deformation of Micron-Thick Single-Crystal Silicon in the Temperature Range of 350–500 °C

2016

Sensors and Materials

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“…The number of interior micro-cracks increases with the volume of the materials. The Weibull distribution probability function is usually used to represent the variation in the fracture strength of brittle materials [18][19][20][21][22][23]. A higher Weibull modulus corresponds to a less scattered fracture strength.…”

Section: Weibull Analysis Of Tensile Strength Of Specimenmentioning

confidence: 99%

“…Having the higher probability of the existence of a larger flaw, the larger specimen has lower strength (size effect) [18,19], as described by Eq. 4.…”

Section: Weibull Analysis Of Tensile Strength Of Specimenmentioning

confidence: 99%

Fracture strength analysis of micro WC-shaft manufactured by micro-electro-discharge machining

Huang

Yan

2004

Int J Adv Manuf Technol

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Micro-electro-discharge machining (micro-EDM) is a potential micro-manufacturing technology. However, the surfaces of micro-components manufactured by micro-EDM will exhibit micro-cracks and micro-craters, and then micro-cracks and micro-craters will produce notch effects leading to stress concentration and reduction of fatigue strength. In particular, the roughness and size of tiny components strongly affect the strength of micro-scale components. Therefore, this study performs micro-tensile tests for micro-shaft specimens of various roughness and size to investigate the influence of roughness and size on the fracture strength of micro WC-shafts manufactured by micro-EDM. Experimental results indicate that the surface roughness, axial surface area, volume, and length of the specimen affect its fracture strength. For specimens of the same size, the mean fracture strength decreases as the surface roughness increases, and the fracture probability of the specimens also increases (roughness effect). For specimens with the same diameter and roughness, increasing the length, volume or axial surface area reduces the mean fracture strength, and increases the fracture probability (size effect).

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“…All the beams tested showed linear elastic behaviour followed by abrupt failure, which is suggestive of brittle fracture. Previously reported numbers of strengths range from 1 to 6 GPa for silicon (Johansson et al 1988;Ericson & Schweitz 1990;Wilson & Beck 1996;Sharpe et al 1997;Sato et al 1998;Tsuchiya et al 1998;Greek et al 1999;Mazza & Dual 1999;Yi et al 2000) and approximately 1 GPa for SiO 2 (Tsuchiya et al 2000) microscale specimens. This clearly indicates that bending strength shows a specimen size dependence.…”

Section: Bending Tests Of Nanostructures Using An Afmmentioning

confidence: 99%

“…In the following, we begin with the stress distribution in smooth nanobeams followed by the effect of surface (110), Bhushan & Venkatesan (1993). b Johansson et al (1988), Ericson & Schweitz (1990), Wilson & Beck (1996), , Sharpe et al (1997), Sato et al (1998), Tsuchiya et al (1998), Greek et al (1999) and Yi et al (2000). c Johansson et al (1989), Ballarini et al (1997), Kahn et al (1999) and Fitzgerald et al (2000).…”

Section: Finite-element Analysis Of Nanostructures With Roughness Andmentioning

confidence: 99%

Nanotribology and nanomechanics in nano/biotechnology

Bhushan

2008

Phil. Trans. R. Soc. A.

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Owing to larger surface area in micro/nanoelectromechanical systems (MEMS/NEMS), surface forces such as adhesion, friction, and meniscus and viscous drag forces become large when compared with inertial and electromagnetic forces. There is a need to develop lubricants and identify lubrication methods that are suitable for MEMS/NEMS. For BioMEMS/BioNEMS, adhesion between biological molecular layers and the substrate, and friction and wear of biological layers may be important, and methods to enhance adhesion between biomolecules and the device surface need to be developed. There is a need for development of a fundamental understanding of adhesion, friction/stiction, wear, the role of surface contamination and environment, and lubrication. MEMS/NEMS materials need to exhibit good mechanical and tribological properties on the micro/nanoscale. Most mechanical properties are known to be scale dependent. Therefore, the properties of nanoscale structures need to be measured. Componentlevel studies are required to provide a better understanding of the tribological phenomena occurring in MEMS/NEMS. The emergence of micro/nanotribology and atomic force microscopy-based techniques has provided researchers with a viable approach to address these problems. This paper presents an overview of micro/nanoscale adhesion, friction, and wear studies of materials and lubrication studies for MEMS/NEMS and BioMEMS/BioNEMS. It also presents a review of scale-dependent mechanical properties, and stress and deformation analysis of nanostructures.

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Specimen size effect on tensile strength of surface-micromachined polycrystalline silicon thin films

Cited by 356 publications

References 9 publications

Irreversible Deformation of Micron-Thick Single-Crystal Silicon in the Temperature Range of 350–500 °C

Irreversible Deformation of Micron-Thick Single-Crystal Silicon in the Temperature Range of 350–500 °C

Fracture strength analysis of micro WC-shaft manufactured by micro-electro-discharge machining

Nanotribology and nanomechanics in nano/biotechnology

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Specimen size effect on tensile strength of surface-micromachined polycrystalline silicon thin films

Cited by 356 publications

References 9 publications

Irreversible Deformation of Micron-Thick Single-Crystal Silicon in the Temperature Range of 350&ndash;500 &deg;C

Irreversible Deformation of Micron-Thick Single-Crystal Silicon in the Temperature Range of 350&ndash;500 &deg;C

Fracture strength analysis of micro WC-shaft manufactured by micro-electro-discharge machining

Nanotribology and nanomechanics in nano/biotechnology

Contact Info

Product

Resources

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Irreversible Deformation of Micron-Thick Single-Crystal Silicon in the Temperature Range of 350–500 °C

Irreversible Deformation of Micron-Thick Single-Crystal Silicon in the Temperature Range of 350–500 °C