2011
DOI: 10.1016/j.tsf.2010.12.074
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Spectroscopic ellipsometry studies on hydrogenated amorphous silicon thin films deposited using DC saddle field plasma enhanced chemical vapor deposition system

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Cited by 12 publications
(6 citation statements)
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“…At temperatures below the epitaxial growth region, increasing the substrate temperature improves the passivation quality as the additional thermal energy assists in hydrogen diffusion in the developing a-Si:H film leading to additional passivation of dangling bonds present at the interface. Other studies using a-Si:H grown by PECVD have shown this same onset of epitaxial growth for substrate temperatures at~200°C [39,40].…”
Section: Effect Of Substrate Temperature On the A-si:h-c-si Interfacesupporting
confidence: 59%
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“…At temperatures below the epitaxial growth region, increasing the substrate temperature improves the passivation quality as the additional thermal energy assists in hydrogen diffusion in the developing a-Si:H film leading to additional passivation of dangling bonds present at the interface. Other studies using a-Si:H grown by PECVD have shown this same onset of epitaxial growth for substrate temperatures at~200°C [39,40].…”
Section: Effect Of Substrate Temperature On the A-si:h-c-si Interfacesupporting
confidence: 59%
“…This sudden decline in passivation quality is attributed to the onset of epitaxial or mixed-phase growth for substrate temperatures above 190°C. Epitaxial and microcrystalline silicon is known to provide poor surface passivation to c-Si as these films do not provide the abrupt smooth interface and hydrogen content required to passivate the c-Si surface [31,39]. At temperatures below the epitaxial growth region, increasing the substrate temperature improves the passivation quality as the additional thermal energy assists in hydrogen diffusion in the developing a-Si:H film leading to additional passivation of dangling bonds present at the interface.…”
Section: Effect Of Substrate Temperature On the A-si:h-c-si Interfacementioning
confidence: 99%
“…Optical model for SE thickness measurement was calibrated against transmission electron microscopy (TEM) measurement and has been reported by Saha et al . . The excess carrier density (ECD) dependent effective minority carrier lifetime, τ eff , was measured using a Sinton Silicon Wafer Lifetime Tester WCT‐120 system.…”
Section: Methodsmentioning
confidence: 99%
“…The obtained E g as a function of applied RF power together with the average deposition rate are both plotted in Figure 3( Another feature of the present films is the higher optical band gap E g than that reported in Refs. [34][35][36] where E g was obtained by the methods other than Tauc method (spectroscopic ellipsometry and surface photovoltage spectroscopy).…”
Section: Optical Band Gap and Deposition Ratementioning
confidence: 99%