Spin-transport across a two-dimensional metal-semiconductor interface with infinite potential in presence of spin-orbit interactions: Double refraction and spin-filtering effect

Bhattacharyya, Kuntal; Kalla, Manasa; Sil, Shreekantha; Chatterjee, Ashok

doi:10.1016/j.micrna.2022.207496

Cited by 1 publication

(1 citation statement)

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“…Metals and their alloy materials, as the main materials used to make the internal fittings of electronic components, assume a key role in the miniaturization of chips through the continuous implementation of technologies such as small capacitance and high adhesion. However, when a semiconductor and a metal come into contact, an interface with discontinuous energy levels is formed, leading to a change in the electron energy distribution, which, in turn, causes a change in the electronic structure, with electronic structure adjustment and charge redistribution phenomena occurring and a semiconductormetal interface effect [29,30]. This change in electronic structure affects the charge density and electric field distribution at the semiconductor-metal interface, which in turn affects the performance of the device.…”

Section: Coupled Systems Of Semiconductor Materials and Metalsmentioning

confidence: 99%

Research Progress in Corrosion Protection Technology for Electronic Components

Zhao,

Liu,

Wang

et al. 2023

Metals

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As a necessary part of all electronic devices, equipment and systems, electronic components play a vital role in the global economy. Since the corrosion of a single electronic component may directly affect the normal operation of the entire electronic system, the failure of electronic components has now become the most important cause of electrical system failure and has become a major obstacle to China’s transformation into a scientific and technological power. Therefore, it is urgent to study the corrosion failure process of electronic components and the means of effective protection. In this paper, starting from the corrosion types and influencing factors of electronic components, especially chips, we introduce the influence of humidity, temperature, salt spray, and environmental particles, as well as the device’s own surface roughness, material adhesion, semiconductor materials, metal coupling system, and lead-free solder system on corrosion performance in the environment. Subsequently, this paper summarizes how to protect electronic components during processing, and sums up the types of electronic component protections, and the specific corrosion protection process for the three commonly used types of chips, namely, the indium antimonide InSb chip, the IC chip, and the Sn–Zn solder chip, for reference. Finally, future development trends in the corrosion protection of electronic components are anticipated and summarized.

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Section: Coupled Systems Of Semiconductor Materials and Metalsmentioning

confidence: 99%