2017
DOI: 10.1108/mi-12-2016-0089
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Spray-on glass solution for fabrication silicon solar cell emitter layer

Abstract: Purpose The main aim of this study was a preparation development of dopant solution (DS) which can be deposited by a spray-on method and subsequently allows obtaining the n+ emitter layer with surface resistance in the range of 65-80 Ω−1. The intention of chosen spray-on method was to gain a cheaper way of dopant source deposition, compared to the commonly used methods, which is of particular importance for the new low-cost production processes. Design/methodology/approach This paper presents the sequence in… Show more

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Cited by 11 publications
(7 citation statements)
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“…Clear cracks of dopant glass are noticeable. A similar phenomenon was observed for phosphorus-based dopant glass described in Filipowski et al (2017).…”
Section: Resultssupporting
confidence: 83%
“…Clear cracks of dopant glass are noticeable. A similar phenomenon was observed for phosphorus-based dopant glass described in Filipowski et al (2017).…”
Section: Resultssupporting
confidence: 83%
“…The dopant sources may be used in solar cell production being deposited onto the wafer surface by means of screen-printing [6,7], spray-on method [8,9], or formed from the gaseous phase [10]. The contact between the electrode and the semiconductor may also depend on the type of the dopant source, which should also be taken into account when analyzing the measurement results.…”
Section: Introductionmentioning
confidence: 99%
“…The process of diffusion doping using phosphorus as the donor dopant is currently the most often used method of crystalline solar cells emitter layer production. Phosphorus sources may be applied onto the plate surface by means of screen-printing (Panek et al , 2003), the spray-on method (Filipowski et al , 2017; Drabczyk et al , 2016) or formed using the gas phase (Li et al , 2017a). The conducted research included the development of a model enabling precise determination of phosphorus concentration profile, on the basis of diffusion process duration and temperature, in monocrystalline silicon for dopant source in the form of a doping paste.…”
Section: Discussionmentioning
confidence: 99%