Sputter and diffusion processes in a plasma immersion device

Bender, Hugo; Halder, Jadab Chandra; Hilschert, F.; Klein, H.; Schäfer, Jan; Seiler, Brian D.; Thomae, R.

doi:10.1016/s0257-8972(97)00047-9

Cited by 6 publications

(2 citation statements)

References 3 publications

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“…Other evidence of temperature related consequences of thermal spikes can be seen in the longer stopping range in experiments using depth profiling characterization techniques. These techniques include Rutherford backscattering (RBS) [67,68] secondary ion mass spectrometry (SIMS) [69] and the post-diffusion of dopants (or sometimes called radiation-enhanced diffusion) in implanted polymers [70][71][72][73][74]. The conclusion, especially for heavy ions in light substrates, shows that the experimental range parameters exceed significantly the ones proposed by the ZBL theory (estimated by the software TRIM).…”

Section: Experimental and Simulation Examples Of Thermal Spike Effectsmentioning

confidence: 99%

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Plasma immersion ion implantation on polymers

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2.1 MODIFICATION OF POLYMERS BY PIIID 11 2.1.1 Polymer structure 12 2.2 SURFACE COMPOSITION OF ION MODIFIED POLYMERS 13 2.3 ION-POLYMER INTERACTIONS 15 2.4 THERMAL SPIKES IN ION IMPLANTATION OF POLYMERS 18 2.5 ELECTRONIC TRANSPORT MECHANISM OF ION MODIFIED POLYMERS 23 2.6 PLASMA IMMERSION ION IMPLANTATION (PHI) 25 2.6.1 Description of the PHI system 28 111 ATTENTION: The Singapore Copyright Act applies to the use of this document. Nanyang Technological University Library 2.6.2 Plasma immersion ion implantation for insulating materials 2.6.2.1 Rise time and ion energy range in PHI 2.6.2.2 Sputtering process 2.6.2.3 Determination of ion energies and incident ion dose rate 2.6.2.4 Charging effects on an insulator's surface 2.6.2.5 Design of experimental setup for insulators 2.6.2.6 Pulse frequency and duration 2.7 CATHODIC ARC SOURCES 2.7.7 Filtered cathodic vacuum arc system 39 2.7.2 Metal cathodic arc source 42 2.8 SUMMARY 43 CHAPTER 3: CHARACTERIZATION TECHNIQUES 44 3.1 VISIBLE RAMAN SPECTROSCOPY 45 3.2 X-RAY PHOTOELECTRON SPECTROSCOPY (XPS) 46 3.3 SCANNING ELECTRON MICROSCOPY (SEM) 47 3.4 X-RAY DIFF ACTION (XRD) 48 3.5 SURFACE PROFILER 49 3.6 CONDUCTIVE ATOMIC FORCE MICROSCOPY (CAFM) 49 3.7 MECHANICAL TESTING 52

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Section: Experimental and Simulation Examples Of Thermal Spike Effectsmentioning

confidence: 99%

“…This process can lead to appreciable surface erosion and ultimately, the removal of already implanted atoms. It may also leads to surface roughening of the modified surfaces as well as accounts for dose limitation of the implanted ions [71].…”

Section: Sputtering Processmentioning

confidence: 99%