2006
DOI: 10.1016/j.molcata.2006.01.020
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Sputter deposited nanocrystalline Ni and Ni-W films as catalysts for hydrogen evolution

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Cited by 99 publications
(44 citation statements)
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“…[7,9,13] Figure 4 presents a comparison between the experimental and calculated Tafel plots after correction for the uncompensated IR drop has been made (the electrolyte resistance of 1.35 Ω was determined from EIS data). The symbols stand for experimental data, while the lines represent the calculated data according to [Eq.…”
Section: Electrocatalytic Activity For Hydrogen Evolutionmentioning
confidence: 99%
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“…[7,9,13] Figure 4 presents a comparison between the experimental and calculated Tafel plots after correction for the uncompensated IR drop has been made (the electrolyte resistance of 1.35 Ω was determined from EIS data). The symbols stand for experimental data, while the lines represent the calculated data according to [Eq.…”
Section: Electrocatalytic Activity For Hydrogen Evolutionmentioning
confidence: 99%
“…The exchange current densities, j0, which represents the magnitude of the rate of H2 evolution, were derived from the intercepts of these lines at zero overpotential according to [Eq. (13)]:…”
Section: Electrocatalytic Activity For Hydrogen Evolutionmentioning
confidence: 99%
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“…It is widely accepted that the HER on a metallic electrode in alkaline solutions, proceeding through the following three reaction mechanism [3][4][5] : …”
Section: Introductionmentioning
confidence: 99%
“…Nanocrystalline nickel (nc-Ni) is a very interesting material due to its enhanced mechanical (Siow et al, 2004;Yang & Vehoff, 2004), corrosion Wang et al, 1996) and catalytic (Metikos-Hukovic et al, 2006) properties. Several preparation techniques have been employed so far in order to obtain a bulk material [severe plastic deformation (Zhilyaev et al, 2002, and references therein), ball milling (Bonetti et al, 1999;Valiev et al, 1997) or inert gas condensation followed by compaction of nanocrystalline powders (Birringer et al, 1984)], thick films [direct or pulsed electrodeposition (Shriram et al, 2000;Palumbo et al, 1997;El-Sherik & Erb, 1995)] or thin films [physical vapour deposition methods, PVD (Knapp & Follstaedt, 2004;Zhong et al, 2004;Brunetti & Monticone, 1993;Hugo et al, 2003;Mitra et al, 2001Mitra et al, , 2004Gai et al, 2002;Hurley et al, 2005)].…”
Section: Introductionmentioning
confidence: 99%