Sputtering—a review of some recent experimental and theoretical aspects

Oechsner, H.

doi:10.1007/bf00896610

Cited by 291 publications

(76 citation statements)

References 117 publications

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“…Furthermore, the sputter yield is strongly dependent on the incident angle of low-energy (~1 keV) projectile ions, increasing from normal incidence up to a maximum yield at 70-80º relative to substrate normal. The difference in sputter yield between normal and high incidence angle seems to be largest for lighter elements, with a more than twofold increase for the case of Ti and Al [27]. This is ascribed to increased occurrence of short anisotropic collision cascades near the surface.…”

Section: Ion Surface Interaction and Preferential Resputteringmentioning

confidence: 86%

Layer formation by resputtering in Ti–Si–C hard coatings during large scale cathodic arc deposition

Eriksson

Zhu

Ghafoor

et al. 2011

Surface and Coatings Technology

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This paper presents the physical mechanism behind the phenomenon of self-layering in thin films made by industrial scale cathodic arc deposition systems using compound Ti-Si-C cathodes and rotating substrate fixture. For the as-deposited films, electron microscopy and energy dispersive X-ray spectrometry reveals a trapezoid modulation in Si content in the substrate normal direction, with a period of 4 to 23 nm dependent on cathode configuration. This is caused by preferential resputtering of Si by the energetic deposition flux incident at high incidence angles, when the substrates are facing away from the cathodes. The Ti-rich sub-layers exhibit TiC grains with sizes up to 5 nm, while layers with high Si-content are less crystalline. The nanoindentation hardness of the films increases with decreasing layer thickness.

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Section: Ion Surface Interaction and Preferential Resputteringmentioning

confidence: 86%

Layer formation by resputtering in Ti–Si–C hard coatings during large scale cathodic arc deposition

Eriksson

Zhu

Ghafoor

et al. 2011

Surface and Coatings Technology

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“…This result can be interpreted in terms of preferential sputtering of Pt atoms. Using the model developed in (18) with the data for relative sputtering cross-sections reported in (19), it can be shown that the bombarded surface composition does not correspond to the equilibrium, but it is 5 enriched in Ti as a result of the sputtering process. From this calculation it appears that the enrichment in platinum of the surface observed upon annealing after sputtering is simply the restoring of the equilibrium composition.…”

Section: Clean Surface Characterizationmentioning

confidence: 99%

Structure and chemisorptive properties of the Pt3Ti surface

Bardi

Dahlgren

Ross

1986

Journal of Catalysis

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“…31,32,33 This feature of BH's theory originates in a property of Sigmund's distribution (1), whose maximum for deposition, r = (0, 0, −a), is located right at the surface under grazing incidence conditions. However, as is well known, there usually exists a value of γ 0 < 90…”

Section: Continuum Approximation To Energy Depositionmentioning

confidence: 99%

“…Moreover, the yields are positive and non-zero for all values of γ 0 , and amount to large sputtering rates, as found in experiments. 31,32,33 . In the present two-dimensional case, for grazing incidence the radial component of the energy distribution vanishes at the point of impact with the surface, but not at finite distances from it, which implies that after surface integration the total deposited energy is non-zero and the yield is positive.…”

Section: B Two-dimensional Interfacesmentioning

confidence: 99%

Influence of collision cascade statistics on pattern formation of ion-sputtered surfaces

et al. 2005

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Theoretical continuum models that describe the formation of patterns on surfaces of targets undergoing ion-beam sputtering, are based on Sigmund's formula, which describes the spatial distribution of the energy deposited by the ion. For small angles of incidence and amorphous or polycrystalline materials, this description seems to be suitable, and leads to the classic BH morphological theory [R. M. Bradley and J. M. E. Harper, J. Vac. Sci. Technol. A 6, 2390(1988]. Here we study the sputtering of Cu crystals by means of numerical simulations under the binary-collision approximation. We observe significant deviations from Sigmund's energy distribution. In particular, the distribution that best fits our simulations has a minimum near the position where the ion penetrates the surface, and the decay of energy deposition with distance to ion trajectory is exponential rather than Gaussian. We provide a modified continuum theory which takes these effects into account and explores the implications of the modified energy distribution for the surface morphology. In marked contrast with BH's theory, the dependence of the sputtering yield with the angle of incidence is non-monotonous, with a maximum for non-grazing incidence angles.

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Sputtering—a review of some recent experimental and theoretical aspects

Cited by 291 publications

References 117 publications

Layer formation by resputtering in Ti–Si–C hard coatings during large scale cathodic arc deposition

Layer formation by resputtering in Ti–Si–C hard coatings during large scale cathodic arc deposition

Structure and chemisorptive properties of the Pt3Ti surface

Influence of collision cascade statistics on pattern formation of ion-sputtered surfaces

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