1990
DOI: 10.1016/0040-6090(90)90008-2
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Sputtering-induced surface roughness of metallic thin films

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Cited by 33 publications
(17 citation statements)
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“…The fitted c 3 value of ~1 implies that the roughness parameter increases linearly with sputtered depth for sputtering of the three Al films. This result is consistent with the one predicted by a statistical model for columnar grain structure . Indeed, the growth model of evaporated Al exhibits a columnar grain structure …”
Section: Resultssupporting
confidence: 91%
“…The fitted c 3 value of ~1 implies that the roughness parameter increases linearly with sputtered depth for sputtering of the three Al films. This result is consistent with the one predicted by a statistical model for columnar grain structure . Indeed, the growth model of evaporated Al exhibits a columnar grain structure …”
Section: Resultssupporting
confidence: 91%
“…Sputtered metallic thin films on an underlying surface universally exhibit a certain roughness 39 . It is logical that this roughness is a function of the amount of material deposited and that also the wetting/adhesion characteristics of the underlying substrate play a role 40 .…”
Section: Discussionmentioning
confidence: 99%
“…5,[9][10][11][12][13][14][15][16][17][18][19][20][21][22] Correlations between topography development and both degradation of the depth resolution 2 ,O-H and changes in secondary ion yields have also been studied. At the beginning of a depth profile, the effects of ion-induced mixing and preferential sputtering are established as steadystate sputtering conditions are achieved.…”
Section: Introductionmentioning
confidence: 99%