Sputtering of indium-tin oxide

Active Soldering of Indium Tin Oxide (ITO) With Cu in Air Using an Sn3.5Ag4Ti(Ce, Ga) Filler

“…[4] In recycling, the used ITO targets are debonded from their Cu backing plates, and the soldering process is generally executed in turn to rebond a new ITO target to the recycled Cu backing plate. [5] To avoid the dissociation of oxygen from the ITO material, the soldering temperature must be lower than 300 °C. Premetallization with nickel films has been the traditional method, followed by soldering with pure indium.…”

High-intensity oxygen cluster ion beam generation and its application to cluster ion-assisted deposition

“…ITO has been applied to optoelectronic devices, such as transparent electrodes of flat panel display devices and photovoltaic devices, because of the low resistivity (∼ 10 −4 Ω cm) and the high transparency to visible light (above 80% at 550 nm) [17][18][19][20]. However, better electrical and optical properties and surface morphology are required for various advanced optoelectronic device applications.…”

Growth and charachterization of indium oxide (InOx) films

“…Many researchers have focused on the deposition of indium tin-doped oxide (ITO) films due to the fact that these films have a higher conductivity compared to the undoped indium oxide films, resulting from the incorporation of a higher valency cation (tin) in the host ln 2 0 3 lattice. ITO films have mainly been produced by the techniques of rf and dc sputtering [55][56][57][58][59][60][61][62][63][64][65][66][67][68][69] and spray pyrolysis [70]. Both of these techniques lead to deposition of ITO films with similar electrical and optical properties, however, the sputtering process has the advantage of producing high quality films, even on plastic substrates, at room temperature [71].…”