Sputtering Targets and Thin Films for Integrated Circuits

Engineered ion-bombardment as a tool in thin film deposition

“…Resultaten som presenteras här har viktiga konsekvenser för många industriella beläggningssystem där det ofta inte är praktiskt möjligt att applicera en spänning på substraten. Contributions to the included papers 1. I was involved in the planning of the study, did all the depositions, conducted all plasma and materials characterizations and wrote the draft of the manuscript.…”

“…It complements, improves or even help create new properties for specific applications. An example are diffusion barrier coatings of Ta, TaN and W applied in between semiconductors and metal interconnects to prevent diffusion of the metal to the semiconductor material [1,2]. These coatings prevent failure of semiconductor devices and therefore increase the reliability of modern-day electronic devices [3].…”

Progresses on Development of Manufacturing Methods of High Purity Tungsten Targets

“…Tungsten has the highest melting point in metals. Furthermore, tungsten has many excellent properties, such as high electrical conductivity, high electromigration resistance, high electron emission coefficient, high thermal stability and so on [3].Tungsten is widely used in the manufacture of bite line, gate material [4], diffusion barrier, via and plugs in semiconductor devices [ 5 -6 ] because of these characters. In summary, the manufacturing methods and the performance of tungsten targets are emphasized and have attracted a lot of studies.…”

“…Fig. 1 Examples of applications of sputtered W films in gate and bit line [4] In this paper, some manufacturing methods of tungsten targets will be introduced. Subsequently, the performance like the grain size, the grain orientation, the density of the targets manufactured by these different methods will be compared and discussed.…”