Stability of the electrodeposition process for CoPt alloy formation

Berkh, O.; Shacham‐Diamand, Yosi; Gileadi, E.

doi:10.1007/s10800-008-9553-z

Cited by 8 publications

(13 citation statements)

References 30 publications

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“…It should be noted that during this pretreatment the pH changes to 6. This peak is associated with oxidation 2 NO − and its disappearance is associated with the replacement of this ligand from the Pt-containing complex by water molecules or citrate ions, as shown in our earlier publication (10). No peak related to Table I).…”

Section: Resultssupporting

confidence: 60%

“…Additionally, more intensive hydrogen evolution from ammonium ions on the electrodes with higher Pt contents can contribute to this correlation. Earlier it was shown that hydrogen evolution can proceed as a result of 4 NH + ions reaction on Pt cathode (10,16). Fig.…”

Section: Nh In Solutionmentioning

confidence: 93%

“…For electrolytes prepared by digesting the mildly acidic or alkaline solutions (Fig.5a) the shape of the LSV is the same as for the electrolytes prepared using untreated Pt NH NO ⎡ ⎤ ⎣ ⎦ complex from which CoPt has already been deposited. (10). Three different regions designated as I, II and III can be distinguished.…”

Section: Nh In Solutionmentioning

confidence: 99%

“…films of CoPtP were produced in the presence of 2 2 NaH PO in the electrolyte. Electrolytes with molar concentration ratios of Co/Pt of 10 and 5 were used for deposition of Co-rich and near equiatomic films, respectively (8)(9)(10). The total-charge effect was studied for the deposition of CoPt alloys in one-and twocompartment cells.…”

Section: Introductionmentioning

confidence: 99%

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Process of CoPt Alloys Electrodeposition for MEMS/NEMS Applications

Berkh¹,

Shacham‐Diamand²,

Gileadi³

2009

ECS Trans.

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CoPt electrodeposited alloys present high interest for application in MEMS/NEMS, because of their interesting magnetic characteristics. Integration of CoPt films into MEMS/NEMS devices is hampered by instability of the deposition process (change of deposition current efficiency and CoPt alloy characteristics with total charge passed through electrolyte in previous runs). The deposition process of CoPt alloys from ammonium citrate electrolyte containing the diammine-dinitrito-platinum (II) complex as the source of Pt is considered in terms of its stability and reliability. Removal of ligands by thermal treatment of Pt complex allows the elimination of the total charge effect on deposition current efficiency. The role of ammonia loss during pretreatment and operation is discussed.

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Section: Resultssupporting

confidence: 60%

Section: Nh In Solutionmentioning

confidence: 93%

Section: Nh In Solutionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Process of CoPt Alloys Electrodeposition for MEMS/NEMS Applications

Berkh¹,

Shacham‐Diamand²,

Gileadi³

2009

ECS Trans.

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“…According to several works on CoPt electrodeposition, hard-magnetic properties are easierly achieved in the as-deposited state when the alloy is plated from alkaline baths above room temperature, typically at 50-60 ºC. [29][30][31] Under these conditions, Co-rich alloys with hexagonal close-packed phase are frequently obtained. Unfortunately, AAO cannot tolerate pH values beyond 8.2 (at room temperature) and undergoes dissolution in the electroplating bath, [32] which is even exacerbated at higher temperatures.…”

Section: Resultsmentioning

confidence: 99%

Toward Robust Segmented Nanowires: Understanding the Impact of Crystallographic Texture on the Quality of Segment Interfaces in Magnetic Metallic Nanowires

Zhang

Sort

Pellicer

2016

Adv Materials Inter

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Segmented nanowires (NWs) have found a wealth of applications due to their multifuctionality, arising from complementarities and synergies among segments of different materials. However, to ensure a practical use of segmented NWs, high quality interfaces between dissimilar segments must be ensured. Herein, tri-segmented CoPt/Cu/Ni NWs and bisegmented CoPt/Ni magnetic NWs are fabricated by means of template-assisted electrodeposition and the characteristics of their interfaces are investigated in detail. The presence of a Cu segment sandwiched between the CoPt and the Ni segments severely affects the integrity of the whole NW. Namely, Cu deposits in a (200) textured face-centered cubic (fcc) structure, which cannot accommodate well on the c-axis oriented hexagonal closepacked CoPt. Instead, when the Cu segment is absent, well-connected CoPt/Ni NWs with smooth interface are obtained. Unlike the Cu segment, Ni shows the (111) textured fcc This is the accepted version of the following article: Zhang, J. et al. "Toward robust segmented nanowires: understanding the imact of crystallographic texture on the quality of segment interfaces in magnetic metallic nanowires" in Advanced materials interfaces,

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Reduction of Ammonium Ion on Pt Electrodes

Berkh¹,

Shacham‐Diamand²,

Gileadi³

2008

J. Electrochem. Soc.

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Studies of deposition of CoPt alloys on Pt from neutral or mildly alkaline solutions containing free ammonia indicated that hydrogen evolution takes place under partial mass-transport controlled conditions, at potentials positive with respect to the potential for reduction of water, indicating that NH 4 + is the proton donor. This assumption was tested experimentally using platinum electrodes, in the absence of platinum and cobalt ions in solution. Our voltammetric studies indicate that a short-lived intermediate could be formed during the potential sweep in the cathodic direction. This is most probably the Rydberg radical NH 4 0 . Although this radical has never been observed in aqueous solution, it may exist in the system studied here, because it can be stabilized by adsorption on the surface. Long plateaus in the plots of the open-circuit potential vs time were observed, following cathodic polarization. These plateaus are attributed to bubbles of molecular hydrogen trapped under the electrode and/or dissolved in the solution adjacent to the surface.

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Stability of the electrodeposition process for CoPt alloy formation

Cited by 8 publications

References 30 publications

Process of CoPt Alloys Electrodeposition for MEMS/NEMS Applications

Process of CoPt Alloys Electrodeposition for MEMS/NEMS Applications

Toward Robust Segmented Nanowires: Understanding the Impact of Crystallographic Texture on the Quality of Segment Interfaces in Magnetic Metallic Nanowires

Reduction of Ammonium Ion on Pt Electrodes

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